View source for 18436499. DEFORMABLE SUBSTRATE CHUCK simplified abstract (Applied Materials, Inc.)

=DEFORMABLE SUBSTRATE CHUCK=


==Organization Name==

[[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]


[[Category:Applied Materials, Inc.]]

==Inventor(s)==

[[:Category:Steven M. Zuniga of Soquel CA (US)|Steven M. Zuniga of Soquel CA (US)]][[Category:Steven M. Zuniga of Soquel CA (US)]]

[[:Category:Jay Gurusamy of Santa Clara CA (US)|Jay Gurusamy of Santa Clara CA (US)]][[Category:Jay Gurusamy of Santa Clara CA (US)]]

[[:Category:Andrew J. Nagengast of Sunnyvale CA (US)|Andrew J. Nagengast of Sunnyvale CA (US)]][[Category:Andrew J. Nagengast of Sunnyvale CA (US)]]

==DEFORMABLE SUBSTRATE CHUCK - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18436499 titled 'DEFORMABLE SUBSTRATE CHUCK

==Simplified Explanation==

The carrier head described in the patent application includes a housing, a support assembly with a support plate flexibly connected to the housing, fluid-impermeable barriers projecting from the support plate to define recesses, and pneumatic control lines. The support plate can be vertically moved by pressurizing chambers in the housing, while the barriers create separate chambers between the support plate and the substrate.

* The carrier head has a support plate that can be moved vertically by applying pressure to chambers in the housing.
* Fluid-impermeable barriers on the support plate create separate chambers between the support plate and the substrate.
* Pneumatic control lines are used to independently pressurize different zones of the carrier head.

== Potential Applications ==
The technology described in the patent application could be used in:
* Semiconductor manufacturing for precise positioning and control of substrates.
* Flat panel display production for uniform pressure distribution during processing.

== Problems Solved ==
This technology addresses issues such as:
* Ensuring consistent pressure distribution across the substrate.
* Allowing for independent control of pressure zones.

== Benefits ==
The benefits of this technology include:
* Improved accuracy and precision in substrate processing.
* Enhanced flexibility in adjusting pressure levels for different areas of the substrate.

== Potential Commercial Applications ==
Potential commercial applications of this technology could include:
* Equipment manufacturers for semiconductor fabrication.
* Companies producing flat panel displays.

== Possible Prior Art ==
One possible prior art for this technology could be the use of pneumatic control lines in similar manufacturing processes to control pressure distribution.

=== Unanswered Questions ===

=== How does this technology compare to existing carrier head designs in terms of efficiency and accuracy? ===
This question can be answered through comparative testing and analysis of the performance of the new carrier head design against traditional designs.

=== What are the potential cost implications of implementing this technology in manufacturing processes? ===
The cost-effectiveness of integrating this technology into manufacturing processes can be determined by conducting a cost-benefit analysis and evaluating the long-term savings and efficiency gains.


==Original Abstract Submitted==

A carrier head includes a housing, a support assembly having a support plate flexibly connected to the housing so as to be vertically movable, a plurality of fluid-impermeable barriers projecting from a bottom of the support plate to define a plurality of recesses that are open at bottom sides thereof, and pneumatic control lines. A volume between the support plate and the housing includes one or more independently pressurizable first chambers to apply pressure on a top surface of the support plate in one or more first zones. The barriers divide a volume between the support plate and the substrate into a plurality of second chambers. The pneumatic control lines are coupled to the plurality of recesses to provide a plurality of independently pressurizable second zones.



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