View source for 18432061. ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

=ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID=


==Organization Name==

[[:Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.|TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]


[[Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]

==Inventor(s)==

[[:Category:Chih-Hao Chen of Taipei City (TW)|Chih-Hao Chen of Taipei City (TW)]][[Category:Chih-Hao Chen of Taipei City (TW)]]

[[:Category:Chin-Fu Kao of Taipei City (TW)|Chin-Fu Kao of Taipei City (TW)]][[Category:Chin-Fu Kao of Taipei City (TW)]]

[[:Category:Li-Hui Cheng of New Taipei City (TW)|Li-Hui Cheng of New Taipei City (TW)]][[Category:Li-Hui Cheng of New Taipei City (TW)]]

[[:Category:Szu-Wei Lu of Hsinchu City (TW)|Szu-Wei Lu of Hsinchu City (TW)]][[Category:Szu-Wei Lu of Hsinchu City (TW)]]

[[:Category:Chih-Chien Pan of Taipei City (TW)|Chih-Chien Pan of Taipei City (TW)]][[Category:Chih-Chien Pan of Taipei City (TW)]]

==ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18432061 titled 'ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID

The abstract describes a package structure and method involving multiple components such as dies, an interposer, underfill layer, thermal interface material (TIM), and adhesive pattern.

* The package structure includes a first die and a second die group placed side by side on the interposer.
* An underfill layer is positioned between the first die and the second die group.
* The adhesive pattern covers the underfill layer between the first die and the second die group.
* The TIM makes direct contact with the first die, second die group, and adhesive pattern, with the adhesive pattern separating the underfill layer from the TIM.

Potential Applications:
- This technology can be applied in semiconductor packaging for electronic devices.
- It can be used in high-performance computing systems.
- Automotive electronics can benefit from this package structure.

Problems Solved:
- Provides efficient thermal management in electronic devices.
- Enhances the reliability and performance of semiconductor packages.
- Facilitates the integration of multiple dies in a compact space.

Benefits:
- Improved thermal dissipation capabilities.
- Enhanced reliability and longevity of electronic components.
- Enables higher performance in electronic devices.

Commercial Applications:
Title: Advanced Semiconductor Packaging Technology for Enhanced Thermal Management
This technology can be utilized in the production of high-performance computers, automotive electronics, and other electronic devices requiring efficient thermal management solutions. The market implications include improved product performance, reliability, and longevity.

Questions about the technology:
1. How does this package structure improve thermal management in electronic devices?
2. What are the key advantages of using a TIM in this package structure?

Frequently Updated Research:
Stay updated on the latest advancements in semiconductor packaging technology, particularly in the area of thermal management and die integration. Research on new materials and techniques for enhancing the performance and reliability of electronic devices.


==Original Abstract Submitted==

Provided are a package structure and a method of forming the same. The package structure includes a first die, a second die group, an interposer, an underfill layer, a thermal interface material (TIM), and an adhesive pattern. The first die and the second die group are disposed side by side on the interposer. The underfill layer is disposed between the first die and the second die group. The adhesive pattern at least overlay the underfill layer between the first die and the second die group. The TIM has a bottom surface being in direct contact with the first die, the second die group, and the adhesive pattern. The adhesive pattern separates the underfill layer from the TIM.



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