View source for 18423577. TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING simplified abstract (Intel Corporation)

=TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Christopher J. Jezewski of Portland OR (US)|Christopher J. Jezewski of Portland OR (US)]][[Category:Christopher J. Jezewski of Portland OR (US)]]

==TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18423577 titled 'TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING

==Simplified Explanation==

The patent application describes tools and methods for subtractively patterning metals at pitches lower than achievable by conventional etch tools and with aspect ratios greater than achievable by conventional etch tools. These tools and methods are cost-effective and suitable for high-volume manufacturing.

* Subtractive patterning of metals at lower pitches
* Achieving aspect ratios greater than conventional etch tools
* Cost-effective and suitable for high-volume manufacturing

== Potential Applications ==
The technology could be applied in the electronics industry for manufacturing circuit boards, in the aerospace industry for creating lightweight metal components, and in the medical field for producing precision instruments.

== Problems Solved ==
The technology solves the problem of limited pitch resolution and aspect ratio in conventional etch tools, allowing for more precise and complex metal patterning.

== Benefits ==
The benefits of this technology include improved precision in metal patterning, cost-effectiveness for high-volume manufacturing, and the ability to create intricate designs with high aspect ratios.

== Potential Commercial Applications ==
"Advanced Metal Patterning Technology for High-Volume Manufacturing"

== Possible Prior Art ==
There is no known prior art for this specific technology.

=== Unanswered Questions ===

=== How does this technology compare to other metal patterning methods currently available in the market? ===
This article does not provide a direct comparison with other metal patterning methods, leaving uncertainty about the specific advantages and disadvantages of this technology in relation to existing options.

=== What are the potential limitations or challenges in implementing this technology on an industrial scale? ===
The article does not address the potential obstacles or difficulties that may arise when scaling up this technology for industrial applications, leaving room for speculation on the practicality and feasibility of large-scale implementation.


==Original Abstract Submitted==

Disclosed herein are tools and methods for subtractively patterning metals. These tools and methods may permit the subtractive patterning of metal (e.g., copper, platinum, etc.) at pitches lower than those achievable by conventional etch tools and/or with aspect ratios greater than those achievable by conventional etch tools. The tools and methods disclosed herein may be cost-effective and appropriate for high-volume manufacturing, in contrast to conventional etch tools.



[[Category:H01L21/67]]
[[Category:H01J37/32]]
[[Category:H01L21/3213]]
[[Category:H01L21/683]]
[[Category:H01L23/528]]