View source for 18421051. SUBSTRATE PROCESSING APPARATUS, TRANSFER METHOD OF SUBSTRATE SUPPORT, RECORDING MEDIUM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (Kokusai Electric Corporation)

=SUBSTRATE PROCESSING APPARATUS, TRANSFER METHOD OF SUBSTRATE SUPPORT, RECORDING MEDIUM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE=


==Organization Name==

[[:Category:Kokusai Electric Corporation|Kokusai Electric Corporation]]


[[Category:Kokusai Electric Corporation]]

==Inventor(s)==

[[:Category:Yukinori Aburatani of Toyama-shi (JP)|Yukinori Aburatani of Toyama-shi (JP)]][[Category:Yukinori Aburatani of Toyama-shi (JP)]]

[[:Category:Naofumi Ohashi of Toyama-shi (JP)|Naofumi Ohashi of Toyama-shi (JP)]][[Category:Naofumi Ohashi of Toyama-shi (JP)]]

==SUBSTRATE PROCESSING APPARATUS, TRANSFER METHOD OF SUBSTRATE SUPPORT, RECORDING MEDIUM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18421051 titled 'SUBSTRATE PROCESSING APPARATUS, TRANSFER METHOD OF SUBSTRATE SUPPORT, RECORDING MEDIUM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

The abstract describes a technique involving a process chamber, substrate supports, a rotatable table, and a heat conduction insulator to suppress heat conduction between the supports.

* Process chamber for substrate processing
* Plurality of substrate supports for supporting the substrate
* Rotatable table with supports for the substrate supports
* Heat conduction insulator to suppress heat conduction between supports

Potential Applications:
- Semiconductor manufacturing
- Thin film deposition processes
- Solar panel production

Problems Solved:
- Minimizing heat transfer between supports
- Ensuring uniform substrate processing

Benefits:
- Improved process efficiency
- Enhanced substrate quality
- Reduced energy consumption

Commercial Applications:
Title: "Advanced Substrate Processing System for Semiconductor Manufacturing"
This technology can be used in semiconductor fabrication facilities to enhance production efficiency and product quality.

Questions about the technology:
1. How does the heat conduction insulator work to suppress heat transfer between the supports?
2. What are the specific advantages of using a rotatable table with supports for substrate processing?


==Original Abstract Submitted==

There is provided a technique that includes a process chamber in which a substrate is processed; a plurality of substrate supports configured to support the substrate; a rotatable table including a plurality of supports configured to support the plurality of substrate supports; and a heat conduction insulator configured to suppress heat conduction between the plurality of supports.



[[Category:H01L21/673]]
[[Category:H01L21/677]]
[[Category:CPC_H01L21/67309]]