View source for 18419389. MONOLITHIC MODULAR MICROWAVE SOURCE WITH INTEGRATED PROCESS GAS DISTRIBUTION simplified abstract (Applied Materials, Inc.)

=MONOLITHIC MODULAR MICROWAVE SOURCE WITH INTEGRATED PROCESS GAS DISTRIBUTION=


==Organization Name==

[[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]


[[Category:Applied Materials, Inc.]]

==Inventor(s)==

[[:Category:JAMES Carducci of Sunnyvale CA (US)|JAMES Carducci of Sunnyvale CA (US)]][[Category:JAMES Carducci of Sunnyvale CA (US)]]

[[:Category:RICHARD C. Fovell of San Jose CA (US)|RICHARD C. Fovell of San Jose CA (US)]][[Category:RICHARD C. Fovell of San Jose CA (US)]]

[[:Category:LARRY D. Elizaga of Tracy CA (US)|LARRY D. Elizaga of Tracy CA (US)]][[Category:LARRY D. Elizaga of Tracy CA (US)]]

[[:Category:SILVERST Rodrigues of Bangalore (IN)|SILVERST Rodrigues of Bangalore (IN)]][[Category:SILVERST Rodrigues of Bangalore (IN)]]

[[:Category:VLADIMIR Knyazik of Santa Clara CA (US)|VLADIMIR Knyazik of Santa Clara CA (US)]][[Category:VLADIMIR Knyazik of Santa Clara CA (US)]]

[[:Category:PHILIP ALLAN Kraus of San Jose CA (US)|PHILIP ALLAN Kraus of San Jose CA (US)]][[Category:PHILIP ALLAN Kraus of San Jose CA (US)]]

[[:Category:THAI CHENG Chua of Cupertino CA (US)|THAI CHENG Chua of Cupertino CA (US)]][[Category:THAI CHENG Chua of Cupertino CA (US)]]

==MONOLITHIC MODULAR MICROWAVE SOURCE WITH INTEGRATED PROCESS GAS DISTRIBUTION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18419389 titled 'MONOLITHIC MODULAR MICROWAVE SOURCE WITH INTEGRATED PROCESS GAS DISTRIBUTION

==Simplified Explanation==
The patent application describes a housing for a source array, with a conductive body having openings and a channel, covered by a cover with holes, and a second hole intersecting with the channel.

* The housing includes a conductive body with a first and second surface.
* Multiple openings are formed through the conductive body.
* A channel is present in the second surface of the conductive body.
* A cover with holes is placed over the channel.
* A second hole is included in the conductive body, intersecting with the channel.

==Key Features and Innovation==
* Housing for a source array with a conductive body.
* Openings and a channel for efficient functionality.
* Cover with holes for protection and access.
* Second hole for additional functionality.

==Potential Applications==
The technology can be used in electronic devices, sensors, and other equipment requiring a housing for source arrays.

==Problems Solved==
The housing provides a secure and functional enclosure for source arrays, protecting them while allowing for necessary access and connections.

==Benefits==
* Enhanced protection for source arrays.
* Efficient design for optimal functionality.
* Easy access for maintenance and connections.

==Commercial Applications==
* Electronics manufacturing for devices.
* Sensor technology for various industries.
* Research and development for advanced equipment.

==Prior Art==
Readers can explore prior patents related to housing designs for source arrays to understand the evolution of this technology.

==Frequently Updated Research==
Stay informed about advancements in housing technology for source arrays to ensure the latest innovations are incorporated into future designs.

==Questions about Housing for Source Arrays==
===What are the key components of the housing for a source array?===
The key components include a conductive body, openings, a channel, a cover with holes, and a second hole for functionality.

===How does the housing design benefit the functionality of source arrays?===
The housing design provides protection, access, and efficient connections for source arrays, enhancing their overall performance.


==Original Abstract Submitted==

Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.



[[Category:H01J37/32]]
[[Category:C23C16/455]]
[[Category:C23C16/511]]
[[Category:CPC_H01J37/3244]]