View source for 18409547. INTERPOSER, METHOD OF DESIGNING INTERPOSER, AND METHOD OF MANUFACTURING INTERPOSER simplified abstract (Samsung Electronics Co., Ltd.)

=INTERPOSER, METHOD OF DESIGNING INTERPOSER, AND METHOD OF MANUFACTURING INTERPOSER=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:Janghee Bae of Suwon-si (KR)|Janghee Bae of Suwon-si (KR)]][[Category:Janghee Bae of Suwon-si (KR)]]

==INTERPOSER, METHOD OF DESIGNING INTERPOSER, AND METHOD OF MANUFACTURING INTERPOSER - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18409547 titled 'INTERPOSER, METHOD OF DESIGNING INTERPOSER, AND METHOD OF MANUFACTURING INTERPOSER

The abstract describes a method of manufacturing an interposer, involving providing a design of the interposer and manufacturing it based on the design. The interposer includes bump pads contacting external connection bumps and spaced apart at a distance greater than a pad interval.

* The method includes generating a library with information about pads of different dimensions and determining the layout of bump pads corresponding to each pad region.
* The layout of the bump pads is determined by selecting a library pad with a target dimension based on the pad interval and pitch distance of target points in each pad region.
* The selected library pad is then placed at the target points in each pad region.

Potential Applications:
- Semiconductor manufacturing
- Electronics packaging
- Integrated circuit design

Problems Solved:
- Efficient interposer manufacturing process
- Precise placement of bump pads
- Optimization of pad layout

Benefits:
- Improved interposer performance
- Enhanced reliability
- Cost-effective manufacturing process

Commercial Applications:
Title: Advanced Interposer Manufacturing Technology for Semiconductor Industry
This technology can be used in the semiconductor industry for producing high-performance interposers, leading to improved product quality and cost savings.

Questions about Interposer Manufacturing:
1. How does the method of selecting library pads improve the efficiency of interposer manufacturing?
   - The method streamlines the process by ensuring precise placement of bump pads, leading to enhanced performance and reliability.
2. What are the potential cost savings associated with this advanced interposer manufacturing technology?
   - The technology can result in cost-effective manufacturing processes, reducing overall production expenses.


==Original Abstract Submitted==

Provided is a method of manufacturing an interposer, the method including providing a design of the interposer, and manufacturing the interposer based the design of the interposer, wherein the interposer includes bump pads contacting external connection bumps and spaced apart from each other at a distance greater than a pad interval, wherein the providing the design of the interposer includes generating a library including information about library pads having different dimensions, and determining a layout of the bump pads corresponding to each of the pad regions, wherein the layout of the bump pads corresponding to each of the pad regions is determined by selecting a library pad from among the library pads having a target dimension based on the pad interval and a pitch distance of target points in each of the pad regions, and placing the selected library pad at the target points in each of the pad regions.



[[Category:H01L23/498]]
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[[Category:H01L23/48]]
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[[Category:H01L25/065]]
[[Category:CPC_H01L23/49838]]