View source for 18403011. BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM simplified abstract (CANON KABUSHIKI KAISHA)

=BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM=


==Organization Name==

[[:Category:CANON KABUSHIKI KAISHA|CANON KABUSHIKI KAISHA]]


[[Category:CANON KABUSHIKI KAISHA]]

==Inventor(s)==

[[:Category:MASAHIRO Kimura of Tochigi (JP)|MASAHIRO Kimura of Tochigi (JP)]][[Category:MASAHIRO Kimura of Tochigi (JP)]]

[[:Category:KENICHIRO Mori of Tochigi (JP)|KENICHIRO Mori of Tochigi (JP)]][[Category:KENICHIRO Mori of Tochigi (JP)]]

==BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18403011 titled 'BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM

The present invention involves a bonding method for attaching multiple objects to a substrate by determining an offset amount to adjust the bonding position on the substrate for each object before bonding them.

* The method involves determining an offset amount to adjust the bonding position on the substrate for each object based on arrangement information representing the arrangement of additional objects to be bonded later.
* After bonding the first set of objects to the substrate, a process of bonding a second set of objects to the first set is performed.
* The offset amount is calculated to meet a predetermined condition based on the arrangement information of the second set of objects on their substrate.

Potential Applications:
- This method can be used in the manufacturing of electronic devices where precise bonding of components is crucial.
- It can also be applied in the production of microelectronics and microfluidic devices.

Problems Solved:
- Ensures accurate alignment and bonding of multiple objects to a substrate.
- Streamlines the process of bonding multiple layers of objects in manufacturing.

Benefits:
- Improved accuracy and efficiency in bonding processes.
- Reduces the margin of error in component alignment.

Commercial Applications:
Title: Precision Bonding Method for Electronic Device Manufacturing
This technology can be utilized in the production of smartphones, tablets, and other electronic devices where precise component bonding is essential. It can also benefit industries involved in microelectronics and microfluidics.

Questions about Precision Bonding Method for Electronic Device Manufacturing:
1. How does this method improve the efficiency of bonding processes in electronic device manufacturing?
2. What are the potential applications of this technology beyond electronic device manufacturing?

Frequently Updated Research:
Researchers are constantly exploring new materials and techniques to enhance the precision and efficiency of bonding methods in various industries. Stay updated on the latest advancements in microelectronics and microfluidics for potential improvements in this technology.


==Original Abstract Submitted==

The present invention provides a bonding method of bonding each of a plurality of first objects to a first substrate, comprising: determining, as an offset amount, an amount to offset a bonding position on the first substrate from a design position for each of the plurality of first objects; and bonding each of the plurality of first objects to the first substrate based on the offset amount determined in the determining, wherein after the bonding, a process of bonding a plurality of second objects which are bonded to a second substrate, to the plurality of first objects bonded to the first substrate is performed, and wherein in the determining, the offset amount is determined to satisfy a predetermined condition based on arrangement information representing an arrangement of the plurality of second objects on the second substrate.



[[Category:H01L23/00]]
[[Category:H01L25/00]]
[[Category:CPC_H01L24/75]]