View source for 18402426. SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS OF MANUFACTURING SACRIFICIAL PILLARS simplified abstract (Micron Technology, Inc.)

=SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS OF MANUFACTURING SACRIFICIAL PILLARS=


==Organization Name==

[[:Category:Micron Technology, Inc.|Micron Technology, Inc.]]


[[Category:Micron Technology, Inc.]]

==Inventor(s)==

[[:Category:Chao Wen Wang of Taichung (TW)|Chao Wen Wang of Taichung (TW)]][[Category:Chao Wen Wang of Taichung (TW)]]

==SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS OF MANUFACTURING SACRIFICIAL PILLARS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18402426 titled 'SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS OF MANUFACTURING SACRIFICIAL PILLARS

==Simplified Explanation==
The patent application describes sacrificial pillars in a semiconductor device assembly to improve the coplanarity of live conductive pillars.

* Sacrificial pillars are identified in a region of a semiconductor die.
* These sacrificial pillars are not connected to bond pads, unlike live conductive pillars.
* The sacrificial pillars prevent abrupt changes in the height of live conductive pillars, enhancing coplanarity.
* After use, the sacrificial pillars are removed from the semiconductor die.

==Key Features and Innovation==
* Identification of sacrificial pillars in a semiconductor die region.
* Prevention of abrupt changes in live conductive pillar heights.
* Improvement of coplanarity in semiconductor device assembly.

==Potential Applications==
The technology can be applied in the semiconductor industry for improving the assembly process of semiconductor devices.

==Problems Solved==
The technology addresses variations in the heights of live conductive pillars, enhancing the overall quality of semiconductor device assemblies.

==Benefits==
* Enhanced coplanarity of live conductive pillars.
* Improved quality and reliability of semiconductor device assemblies.

==Commercial Applications==
* "Sacrificial Pillars for Semiconductor Device Assembly" can be utilized in the manufacturing of various semiconductor devices, enhancing their performance and longevity.

==Prior Art==
No specific prior art information is provided in the abstract.

==Frequently Updated Research==
There is no information on frequently updated research related to this technology.

==Questions about Sacrificial Pillars for Semiconductor Device Assembly==
===Question 1===
How do sacrificial pillars contribute to improving the coplanarity of live conductive pillars in a semiconductor device assembly?

Sacrificial pillars in a semiconductor device assembly help prevent abrupt changes in the height of live conductive pillars, thereby enhancing coplanarity by reducing variations in pillar heights.

===Question 2===
What is the significance of sacrificial pillars not being connected to bond pads in the semiconductor die?

The sacrificial pillars being separate from bond pads ensure that they do not interfere with the functionality of the live conductive pillars, allowing for a more controlled and effective coplanarity improvement process.


==Original Abstract Submitted==

Sacrificial pillars for a semiconductor device assembly, and associated methods and systems are disclosed. In one embodiment, a region of a semiconductor die may be identified to include sacrificial pillars that are not connected to bond pads of the semiconductor die, in addition to live conductive pillars connected to the bond pads. The region with the sacrificial pillars, when disposed in proximity to the live conductive pillars, may prevent an areal density of the live conductive pillars from experiencing an abrupt change that may result in intolerable variations in heights of the live conductive pillars. As such, the sacrificial pillars may improve a coplanarity of the live conductive pillars by reducing variations in the heights of the live conductive pillars. Thereafter, the sacrificial pillars may be removed from the semiconductor die.



[[Category:H01L23/00]]
[[Category:CPC_H01L24/11]]