View source for 18400880. ELECTRONIC DEVICE (HYUNDAI MOBIS CO., LTD.)

=ELECTRONIC DEVICE=


==Organization Name==

[[:Category:HYUNDAI MOBIS CO., LTD.|HYUNDAI MOBIS CO., LTD.]]


[[Category:HYUNDAI MOBIS CO., LTD.]]

==Inventor(s)==

[[:Category:Chan Woong Jung of Yongin-si KR|Chan Woong Jung of Yongin-si KR]][[Category:Chan Woong Jung of Yongin-si KR]]

[[:Category:Jang Hoon Lee of Yongin-si KR|Jang Hoon Lee of Yongin-si KR]][[Category:Jang Hoon Lee of Yongin-si KR]]

[[:Category:Won Ju Kim of Yongin-si KR|Won Ju Kim of Yongin-si KR]][[Category:Won Ju Kim of Yongin-si KR]]

[[:Category:Sang Il Lee of Yongin-si KR|Sang Il Lee of Yongin-si KR]][[Category:Sang Il Lee of Yongin-si KR]]

[[:Category:Kang Il Ma of Yongin-si KR|Kang Il Ma of Yongin-si KR]][[Category:Kang Il Ma of Yongin-si KR]]

[[:Category:Hae Jung Kim of Yongin-si KR|Hae Jung Kim of Yongin-si KR]][[Category:Hae Jung Kim of Yongin-si KR]]

[[:Category:Ji Min Song of Yongin-si KR|Ji Min Song of Yongin-si KR]][[Category:Ji Min Song of Yongin-si KR]]

==ELECTRONIC DEVICE==


This abstract first appeared for US patent application 18400880 titled 'ELECTRONIC DEVICE

==Original Abstract Submitted==

An electronic device includes a housing, a slot disposed in an interior of the housing, wherein the slot is configured to permit an electronic module inserted into the slot, a cooling member disposed outside the slot to cool the electronic module, and a heat transfer member configured to be connected to the electronic module to transfer heat from the electronic module to the cooling member.



[[Category:H05K7/20]]
[[Category:CPC_H05K7/20854]]