View source for 18393077. POLISHING APPARATUS AND POLISHING METHOD simplified abstract (EBARA CORPORATION)

=POLISHING APPARATUS AND POLISHING METHOD=


==Organization Name==

[[:Category:EBARA CORPORATION|EBARA CORPORATION]]


[[Category:EBARA CORPORATION]]

==Inventor(s)==

[[:Category:Masaki Kinoshita of Tokyo (JP)|Masaki Kinoshita of Tokyo (JP)]][[Category:Masaki Kinoshita of Tokyo (JP)]]

[[:Category:Keita Yagi of Tokyo (JP)|Keita Yagi of Tokyo (JP)]][[Category:Keita Yagi of Tokyo (JP)]]

==POLISHING APPARATUS AND POLISHING METHOD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18393077 titled 'POLISHING APPARATUS AND POLISHING METHOD

'''Simplified Explanation:'''
The patent application describes a polishing apparatus that includes a polishing table and a polishing head to polish a substrate. Multiple optical heads detect the film thickness of the substrate, with a spectrometer processing the signals from these heads. An optical switch connects the sensor heads to the spectrometer, controlled by a processor to switch connections between sensor heads.

* Detects film thickness of substrate
* Uses multiple optical heads and a spectrometer
* Optical switch connects sensor heads to spectrometer
* Processor controls switching between sensor heads
* Polishing apparatus for substrates

'''Key Features and Innovation:'''
- Utilizes multiple optical heads to detect film thickness
- Spectrometer processes signals from optical heads
- Optical switch for connecting sensor heads to spectrometer
- Processor controls switching between sensor heads
- Enhances polishing process by monitoring film thickness

'''Potential Applications:'''
- Semiconductor manufacturing
- Optics industry
- Thin film deposition processes

'''Problems Solved:'''
- Accurate monitoring of film thickness during polishing
- Enhanced control over polishing process
- Improved quality and consistency of polished substrates

'''Benefits:'''
- Increased efficiency in polishing operations
- Enhanced precision in film thickness measurement
- Improved overall quality of polished substrates

'''Commercial Applications:'''
Title: Advanced Polishing Apparatus for Substrates
This technology can be applied in industries such as semiconductor manufacturing, optics, and thin film deposition processes. It offers improved control and accuracy in polishing operations, leading to higher quality finished products. The market implications include increased efficiency and productivity in substrate polishing processes.

'''Prior Art:'''
Prior art related to this technology may include patents or research papers on optical sensing systems for film thickness measurement in manufacturing processes. Researchers can explore existing literature on spectrometry and optical switches in polishing equipment to understand the background of this innovation.

'''Frequently Updated Research:'''
Researchers in the field of semiconductor manufacturing and thin film deposition may be conducting studies on advanced optical sensing technologies for process control and monitoring. Stay updated on the latest developments in spectrometry and optical switch applications in polishing apparatus to enhance your understanding of this technology.

'''Questions about Polishing Apparatus for Substrates:'''
1. How does the optical switch improve the efficiency of film thickness measurement in the polishing process?
2. What are the potential challenges in integrating multiple optical heads for detecting film thickness in a polishing apparatus?


==Original Abstract Submitted==

A polishing apparatus that polishes a substrate includes a polishing table for holding a polishing pad and a polishing head configured to press a surface of the substrate against the polishing pad. A plurality of first optical heads detect a signal concerning a film thickness of the substrate while moving across the substrate. One spectrometer receives and processes signals output by at least two first sensor heads among the plurality of first sensor heads. An optical switch selectively connects the sensor heads to the spectrometer. A processor controls the optical switch to switch, at timing when the plurality of sensor heads simultaneously face the substrate, the connection to the spectrometer from one sensor head to another sensor head.



[[Category:B24B49/04]]
[[Category:B24B37/10]]
[[Category:CPC_B24B49/045]]