View source for 18391891. CHIP PACKAGE WITH LID simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

=CHIP PACKAGE WITH LID=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]

==Inventor(s)==

[[:Category:Shu-Shen Yeh of Taoyuan City (TW)|Shu-Shen Yeh of Taoyuan City (TW)]][[Category:Shu-Shen Yeh of Taoyuan City (TW)]]

[[:Category:Chin-Hua Wang of New Taipei City (TW)|Chin-Hua Wang of New Taipei City (TW)]][[Category:Chin-Hua Wang of New Taipei City (TW)]]

[[:Category:Kuang-Chun Lee of New Taipei City (TW)|Kuang-Chun Lee of New Taipei City (TW)]][[Category:Kuang-Chun Lee of New Taipei City (TW)]]

[[:Category:Po-Yao Lin of Zhudong Township (TW)|Po-Yao Lin of Zhudong Township (TW)]][[Category:Po-Yao Lin of Zhudong Township (TW)]]

[[:Category:Shyue-Ter Leu of Hsinchu City (TW)|Shyue-Ter Leu of Hsinchu City (TW)]][[Category:Shyue-Ter Leu of Hsinchu City (TW)]]

[[:Category:Shin-Puu Jeng of Po-Shan Village (TW)|Shin-Puu Jeng of Po-Shan Village (TW)]][[Category:Shin-Puu Jeng of Po-Shan Village (TW)]]

==CHIP PACKAGE WITH LID - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18391891 titled 'CHIP PACKAGE WITH LID

==Simplified Explanation==

The chip package described in the patent application includes a substrate, a semiconductor chip, and a thermal conductive structure. The package also features first and second support structures below the thermal conductive structure, connecting the substrate and corners of the thermal conductive structure. The support structures, along with a side edge of the thermal conductive structure, define an opening exposing a space surrounding the semiconductor chip. The first support structure is laterally separated from the side of the substrate by a first lateral distance, while the side edge of the thermal conductive structure is laterally separated from the side of the substrate by a second lateral distance different from the first.

* Substrate, semiconductor chip, and thermal conductive structure in chip package
* First and second support structures connecting substrate and thermal conductive structure
* Opening exposing space around semiconductor chip
* Different lateral distances separating support structures and side edge from substrate

== Potential Applications ==
This technology could be applied in:
* Electronic devices
* Computer systems
* Automotive systems

== Problems Solved ==
This technology helps to:
* Improve thermal conductivity
* Enhance heat dissipation
* Protect semiconductor chips

== Benefits ==
The benefits of this technology include:
* Increased efficiency
* Extended lifespan of semiconductor chips
* Enhanced performance of electronic devices

== Potential Commercial Applications ==
This technology could be commercially benefit:
* Electronics manufacturers
* Semiconductor companies
* Automotive industry

== Possible Prior Art ==
One possible prior art for this technology could be:
* Existing chip packaging designs
* Previous thermal management solutions

=== Unanswered Questions ===

=== How does this technology compare to existing thermal management solutions in terms of efficiency and cost-effectiveness? ===
This article does not provide a direct comparison with existing solutions in terms of efficiency and cost-effectiveness. Further research and testing would be needed to determine the advantages of this technology over others.

=== What specific electronic devices or systems could benefit the most from implementing this chip package design? ===
The article does not specify the specific electronic devices or systems that could benefit the most from this chip package design. Further analysis and market research would be required to identify the target applications for this technology.


==Original Abstract Submitted==

A chip package includes a substrate, a semiconductor chip, and a thermal conductive structure. The chip package includes a first and a second support structures below the thermal conductive structure. The first and the second support structures connect the substrate and corners of the thermal conductive structure. The thermal conductive structure has a side edge connecting the first and the second support structures. The first and the second support structures and the side edge together define of an opening exposing a space surrounding the semiconductor chip. The first and the second support structures are disposed along a side of the substrate. The first support structure is laterally separated from the side of the substrate by a first lateral distance. The side edge of the thermal conductive structure is laterally separated from the side of the substrate by a second lateral distance different than the first lateral distance.



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