View source for 18391651. CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METHODS FOR MANUFACTURING CERAMIC SINTERED COMPACT SUBSTRATE AND LIGHT-EMITTING DEVICE simplified abstract (NICHIA CORPORATION)

=CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METHODS FOR MANUFACTURING CERAMIC SINTERED COMPACT SUBSTRATE AND LIGHT-EMITTING DEVICE=


==Organization Name==

[[:Category:NICHIA CORPORATION|NICHIA CORPORATION]]


[[Category:NICHIA CORPORATION]]

==Inventor(s)==

[[:Category:Akiko Nagae of Komatsushima-shi (JP)|Akiko Nagae of Komatsushima-shi (JP)]][[Category:Akiko Nagae of Komatsushima-shi (JP)]]

[[:Category:Masaaki Katsumata of Anan-shi (JP)|Masaaki Katsumata of Anan-shi (JP)]][[Category:Masaaki Katsumata of Anan-shi (JP)]]

==CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METHODS FOR MANUFACTURING CERAMIC SINTERED COMPACT SUBSTRATE AND LIGHT-EMITTING DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18391651 titled 'CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METHODS FOR MANUFACTURING CERAMIC SINTERED COMPACT SUBSTRATE AND LIGHT-EMITTING DEVICE

The manufacturing method for a ceramic sintered compact substrate involves bonding dry films to a ceramic substrate, forming recessed portions, disposing a metal paste, and firing to obtain a metal member.

* Dry films are bonded to the first and second surfaces of the ceramic substrate.
* Etching or blasting is performed through the dry films to create a predetermined pattern.
* Recessed portions are formed on both surfaces of the ceramic substrate.
* A metal paste is disposed in the recessed portions and through holes.
* The metal paste is fired to create a metal member.

Potential Applications:
- This method can be used in the production of electronic components such as circuit boards.
- It can also be applied in the manufacturing of sensors and actuators.

Problems Solved:
- Provides a reliable method for creating metal members on ceramic substrates.
- Allows for precise patterning and integration of metal components.

Benefits:
- Improved efficiency in manufacturing ceramic sintered compact substrates.
- Enhanced durability and functionality of electronic devices.

Commercial Applications:
Title: Advanced Manufacturing Method for Ceramic Sintered Compact Substrates
This technology can be utilized in the electronics industry for producing high-quality components with intricate metal patterns. It can also find applications in the automotive sector for creating sensors and other electronic devices.

Questions about the Advanced Manufacturing Method for Ceramic Sintered Compact Substrates:
1. How does this method compare to traditional techniques for creating metal components on ceramic substrates?
- This method offers a more precise and efficient way of integrating metal components onto ceramic substrates compared to traditional methods like screen printing.
2. What are the key advantages of using dry films in this manufacturing process?
- Dry films provide a clean and controlled way of patterning the metal paste on the ceramic substrate, ensuring accuracy and consistency in the final product.


==Original Abstract Submitted==

A manufacturing method for a ceramic sintered compact substrate including preparing a ceramic substrate, bonding dry films to a first surface and a second surface of the ceramic substrate, performing exposure and development, performing etching or blasting through the dry films formed into a predetermined pattern, forming a first recessed portion recessed relative to a first flat surface portion of the first surface and a second recessed portion recessed relative to a second flat surface portion of the second surface, peeling off the dry films, disposing a metal paste, and firing the metal paste to obtain a metal member. In the method, before the first recessed portion and the second recessed portion are formed, a through hole penetrating through the ceramic substrate is formed , and the metal paste is disposed in the first recessed portion, the second recessed portion, and the through hole.



[[Category:H01L33/62]]
[[Category:H01L23/00]]
[[Category:H05K3/00]]
[[Category:H05K3/24]]
[[Category:H05K3/40]]
[[Category:CPC_H01L33/62]]