View source for 18390323. SUBSTRATE ETCHING APPARATUS AND SUBSTRATE ETCHING METHOD simplified abstract (Samsung Display Co., LTD.)

=SUBSTRATE ETCHING APPARATUS AND SUBSTRATE ETCHING METHOD=


==Organization Name==

[[:Category:Samsung Display Co., LTD.|Samsung Display Co., LTD.]]


[[Category:Samsung Display Co., LTD.]]

==Inventor(s)==

[[:Category:Yonghyun Kim of Yongin-si (KR)|Yonghyun Kim of Yongin-si (KR)]][[Category:Yonghyun Kim of Yongin-si (KR)]]

[[:Category:Kyu-Bum Kim of Yongin-si (KR)|Kyu-Bum Kim of Yongin-si (KR)]][[Category:Kyu-Bum Kim of Yongin-si (KR)]]

[[:Category:Seung Ho Myoung of Yongin-si (KR)|Seung Ho Myoung of Yongin-si (KR)]][[Category:Seung Ho Myoung of Yongin-si (KR)]]

[[:Category:Yeongmin Kim of Yongin-si (KR)|Yeongmin Kim of Yongin-si (KR)]][[Category:Yeongmin Kim of Yongin-si (KR)]]

[[:Category:Ju Yeong Yun of Yongin-si (KR)|Ju Yeong Yun of Yongin-si (KR)]][[Category:Ju Yeong Yun of Yongin-si (KR)]]

[[:Category:Jungwoo Choi of Yongin-si (KR)|Jungwoo Choi of Yongin-si (KR)]][[Category:Jungwoo Choi of Yongin-si (KR)]]

==SUBSTRATE ETCHING APPARATUS AND SUBSTRATE ETCHING METHOD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18390323 titled 'SUBSTRATE ETCHING APPARATUS AND SUBSTRATE ETCHING METHOD

'''Simplified Explanation:'''
The patent application describes a substrate etching apparatus that includes a stage moving part for supporting a substrate carrier with a substrate attached, moving it vertically and horizontally, a substrate carrier loading part for loading the substrate carrier onto the stage moving part, and an etching part for etching the substrate attached to the substrate carrier.

'''Key Features and Innovation:'''
* Stage moving part supports and moves the substrate carrier vertically and horizontally.
* Substrate carrier loading part loads the substrate carrier onto the stage moving part.
* Etching part etches the substrate attached to the substrate carrier.
* Efficient substrate etching process with precise control.

'''Potential Applications:'''
The technology can be used in semiconductor manufacturing, microelectronics, and other industries requiring precise substrate etching processes.

'''Problems Solved:'''
The technology addresses the need for accurate and efficient substrate etching, improving overall manufacturing processes in various industries.

'''Benefits:'''
* Enhanced precision in substrate etching.
* Increased efficiency in manufacturing processes.
* Improved quality of end products.

'''Commercial Applications:'''
The technology can be applied in semiconductor fabrication facilities, electronics manufacturing plants, and research institutions for advanced material processing.

'''Prior Art:'''
Further research can be conducted on similar substrate etching apparatuses and technologies in the field of semiconductor manufacturing and microelectronics.

'''Frequently Updated Research:'''
Stay updated on advancements in substrate etching technologies, semiconductor manufacturing processes, and material processing techniques for potential improvements in the technology.

'''Questions about Substrate Etching Apparatus:'''
1. What are the specific industries that can benefit from this substrate etching technology?
2. How does the substrate etching apparatus improve the overall efficiency of manufacturing processes?


==Original Abstract Submitted==

A substrate etching apparatus includes: a stage moving part for supporting a substrate carrier to which a substrate is attached in a vertical direction and for moving the substrate carrier to which the substrate is attached in a horizontal direction; a substrate carrier loading part positioned in a first region in the horizontal direction and for loading the substrate carrier to which the substrate is attached to the stage moving part; and an etching part positioned in a second region adjacent to the first region in the horizontal direction and for etching the substrate attached to the substrate carrier supported on the stage moving part in the vertical direction.



[[Category:H01L21/67]]
[[Category:H01L21/677]]
[[Category:H01L21/687]]
[[Category:CPC_H01L21/67069]]