View source for 18390205. METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)

=METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING THE SEMICONDUCTOR PACKAGE=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:Junghyun Roh of Suwon-si (KR)|Junghyun Roh of Suwon-si (KR)]][[Category:Junghyun Roh of Suwon-si (KR)]]

[[:Category:Wangsun Lim of Suwon-si (KR)|Wangsun Lim of Suwon-si (KR)]][[Category:Wangsun Lim of Suwon-si (KR)]]

[[:Category:Manhee Han of Suwon-si (KR)|Manhee Han of Suwon-si (KR)]][[Category:Manhee Han of Suwon-si (KR)]]

[[:Category:Jaeyoung Hong of Suwon-si (KR)|Jaeyoung Hong of Suwon-si (KR)]][[Category:Jaeyoung Hong of Suwon-si (KR)]]

==METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18390205 titled 'METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING THE SEMICONDUCTOR PACKAGE

The method described in the abstract involves fabricating a semiconductor package by covering a semiconductor substrate and conductive pad with passivation and protective layers, exposing the conductive pad, grinding the substrate, dicing it, and removing the protective layer to expose the pad.

* Passivation layer and protective layers are formed on a semiconductor substrate and conductive pad.
* Portions of the passivation and protective layers are removed to expose the conductive pad.
* A second protective layer is formed over the exposed conductive pad.
* The substrate is ground on one surface and diced.
* The protective layer is removed to expose the conductive pad after grinding and dicing.

Potential Applications:
- Semiconductor manufacturing
- Electronics industry

Problems Solved:
- Protecting the conductive pad during fabrication processes
- Ensuring the integrity of the semiconductor package

Benefits:
- Improved reliability of semiconductor packages
- Enhanced protection of the conductive pad during manufacturing

Commercial Applications:
Title: Semiconductor Package Fabrication Method
This technology can be used in the semiconductor industry to enhance the production process of semiconductor packages, leading to more reliable and durable electronic devices.

Questions about Semiconductor Package Fabrication Method:
1. How does the method ensure the protection of the conductive pad during fabrication?
The method involves the use of multiple protective layers to shield the conductive pad from damage during various manufacturing processes.

2. What are the potential applications of this technology beyond semiconductor manufacturing?
This technology could potentially be applied in other industries that require precise and reliable packaging of electronic components.


==Original Abstract Submitted==

Provided is a method of fabricating a semiconductor package, the method including forming a passivation layer and a first protective layer covering a semiconductor substrate and conductive pad above a first surface of the semiconductor substrate, removing a portion of the passivation layer and a portion of the first protective layer to expose the conductive pad, forming a second protective layer covering the conductive pad on the first protective layer, grinding a second surface opposite the first surface of the semiconductor substrate, dicing the semiconductor substrate, and removing the second protective layer to expose the conductive pad, wherein the second protective layer does not expose the conductive pad during the grinding and during the dicing.



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[[Category:H01L21/56]]
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