View source for 18390078. APPARATUS FOR TREATING SUBSTRATE simplified abstract (SEMES CO., LTD.)

=APPARATUS FOR TREATING SUBSTRATE=


==Organization Name==

[[:Category:SEMES CO., LTD.|SEMES CO., LTD.]]


[[Category:SEMES CO., LTD.]]

==Inventor(s)==

[[:Category:Yoon Seok Choi of Suwon-si (KR)|Yoon Seok Choi of Suwon-si (KR)]][[Category:Yoon Seok Choi of Suwon-si (KR)]]

[[:Category:Yun Sang Kim of Seongnam-si (KR)|Yun Sang Kim of Seongnam-si (KR)]][[Category:Yun Sang Kim of Seongnam-si (KR)]]

[[:Category:Sang Jeong Lee of Hwaseong-si (KR)|Sang Jeong Lee of Hwaseong-si (KR)]][[Category:Sang Jeong Lee of Hwaseong-si (KR)]]

[[:Category:Jae Won Shin of Suwon-si (KR)|Jae Won Shin of Suwon-si (KR)]][[Category:Jae Won Shin of Suwon-si (KR)]]

[[:Category:Jong Won Park of Yongin-si (KR)|Jong Won Park of Yongin-si (KR)]][[Category:Jong Won Park of Yongin-si (KR)]]

==APPARATUS FOR TREATING SUBSTRATE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18390078 titled 'APPARATUS FOR TREATING SUBSTRATE

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space; a support unit configured to support a substrate in the treating space; a window plate positioned above the treating space; and a conductive layer formed on the window plate, wherein a bottom surface of the window plate is exposed to the treating space, and the conductive layer is formed on a top surface among a top surface and a bottom surface of the window plate.

* The apparatus is designed to treat substrates within a chamber.
* A support unit holds the substrate in place within the treating space.
* A window plate is positioned above the treating space.
* A conductive layer is applied to the top surface of the window plate.
* The conductive layer allows for efficient treatment of the substrate.

Potential Applications:
This technology could be used in semiconductor manufacturing processes, thin film deposition, and other industries requiring precise substrate treatment.

Problems Solved:
This apparatus solves the problem of ensuring uniform treatment of substrates by providing a conductive layer on the window plate.

Benefits:
The benefits of this technology include improved substrate treatment efficiency, enhanced uniformity, and potentially higher quality end products.

Commercial Applications:
This technology could be valuable in the semiconductor industry, electronics manufacturing, and research institutions focusing on thin film deposition processes.

Questions about Substrate Treating Apparatus:
1. How does the conductive layer on the window plate improve substrate treatment efficiency?
2. What are the potential applications of this technology beyond semiconductor manufacturing?


==Original Abstract Submitted==

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space; a support unit configured to support a substrate in the treating space; a window plate positioned above the treating space; and a conductive layer formed on the window plate, and wherein a bottom surface of the window plate is exposed to the treating space, and the conductive layer is formed on a top surface among a top surface and a bottom surface of the window plate.



[[Category:H01J37/32]]
[[Category:CPC_H01J37/32697]]