View source for 18389613. STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND RELATED METHODS, DEVICES, AND SYSTEMS simplified abstract (Micron Technology, Inc.)

=STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND RELATED METHODS, DEVICES, AND SYSTEMS=


==Organization Name==

[[:Category:Micron Technology, Inc.|Micron Technology, Inc.]]


[[Category:Micron Technology, Inc.]]

==Inventor(s)==

[[:Category:Seng Kim Dalson Ye of Singapore (SG)|Seng Kim Dalson Ye of Singapore (SG)]][[Category:Seng Kim Dalson Ye of Singapore (SG)]]

[[:Category:Kelvin Tan Aik Boo of Singapore (SG)|Kelvin Tan Aik Boo of Singapore (SG)]][[Category:Kelvin Tan Aik Boo of Singapore (SG)]]

[[:Category:Hong Wan Ng of Singapore (SG)|Hong Wan Ng of Singapore (SG)]][[Category:Hong Wan Ng of Singapore (SG)]]

[[:Category:See Hiong Leow of Singapore (SG)|See Hiong Leow of Singapore (SG)]][[Category:See Hiong Leow of Singapore (SG)]]

[[:Category:Ling Pan of Singapore (SG)|Ling Pan of Singapore (SG)]][[Category:Ling Pan of Singapore (SG)]]

==STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND RELATED METHODS, DEVICES, AND SYSTEMS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18389613 titled 'STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND RELATED METHODS, DEVICES, AND SYSTEMS

The abstract of the patent application describes a microelectronic device package that includes a stack of semiconductor dies positioned over a substrate. An interposer structure is coupled to the stack of semiconductor dies, and an electronic component is directly coupled to the interposer structure and electrically connected to the substrate through an electrical connection between the interposer structure and the substrate.

* The microelectronic device package includes a stack of semiconductor dies.
* An interposer structure is coupled to the stack of semiconductor dies.
* An electronic component is directly coupled to the interposer structure.
* The electronic component is electrically connected to the substrate through an electrical connection between the interposer structure and the substrate.

Potential Applications:
- This technology can be used in the manufacturing of advanced microelectronic devices.
- It can be applied in the development of high-performance electronic systems.
- The package design can be utilized in various industries such as telecommunications, automotive, and consumer electronics.

Problems Solved:
- Provides a compact and efficient way to integrate multiple semiconductor dies in a package.
- Enables direct coupling of electronic components to the interposer structure for improved performance.
- Facilitates electrical connections between the electronic components and the substrate.

Benefits:
- Enhanced performance and reliability of microelectronic devices.
- Improved thermal management due to the efficient design of the package.
- Cost-effective manufacturing process for complex electronic systems.

Commercial Applications:
- This technology can be valuable in the production of high-end electronic devices for consumer and industrial use.
- It can be utilized by semiconductor manufacturers to enhance the performance of their products.
- The innovative package design can open up new possibilities in the development of advanced electronic systems.

Questions about the technology:
1. How does the direct coupling of electronic components to the interposer structure improve performance?
2. What are the potential cost savings associated with using this microelectronic device package design?


==Original Abstract Submitted==

A microelectronic device package includes a stack of semiconductor dies positioned over a substrate. The microelectronic device package further includes an interposer structure coupled to the stack of semiconductor dies. The microelectronic device package further includes an electronic component directly coupled to the interposer structure and electrically coupled to the substrate through an electrical connection between the interposer structure and the substrate.



[[Category:H01L25/16]]
[[Category:H01L23/498]]
[[Category:CPC_H01L25/16]]