View source for 18383226. CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN AND METHOD OF POLISHING TUNGSTEN USING THE SAME simplified abstract (SAMSUNG SDI CO., LTD.)

=CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN AND METHOD OF POLISHING TUNGSTEN USING THE SAME=


==Organization Name==

[[:Category:SAMSUNG SDI CO., LTD.|SAMSUNG SDI CO., LTD.]]


[[Category:SAMSUNG SDI CO., LTD.]]

==Inventor(s)==

[[:Category:Keun Sam Jang of Suwon-si (KR)|Keun Sam Jang of Suwon-si (KR)]][[Category:Keun Sam Jang of Suwon-si (KR)]]

[[:Category:Won Jung Kim of Suwon-si (KR)|Won Jung Kim of Suwon-si (KR)]][[Category:Won Jung Kim of Suwon-si (KR)]]

[[:Category:Tae Won Park of Suwon-si (KR)|Tae Won Park of Suwon-si (KR)]][[Category:Tae Won Park of Suwon-si (KR)]]

[[:Category:Ji Ho Lee of Suwon-si (KR)|Ji Ho Lee of Suwon-si (KR)]][[Category:Ji Ho Lee of Suwon-si (KR)]]

[[:Category:Eui Rang Lee of Suwon-si (KR)|Eui Rang Lee of Suwon-si (KR)]][[Category:Eui Rang Lee of Suwon-si (KR)]]

[[:Category:Jin Gyo Kim of Suwon-si (KR)|Jin Gyo Kim of Suwon-si (KR)]][[Category:Jin Gyo Kim of Suwon-si (KR)]]

[[:Category:Dong Hyeon Lee of Suwon-si (KR)|Dong Hyeon Lee of Suwon-si (KR)]][[Category:Dong Hyeon Lee of Suwon-si (KR)]]

[[:Category:Chang Suk Lee of Suwon-si (KR)|Chang Suk Lee of Suwon-si (KR)]][[Category:Chang Suk Lee of Suwon-si (KR)]]

==CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN AND METHOD OF POLISHING TUNGSTEN USING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18383226 titled 'CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN AND METHOD OF POLISHING TUNGSTEN USING THE SAME

==Simplified Explanation==

The patent application is for a CMP slurry composition used for polishing tungsten, which includes a polar or nonpolar solvent, an abrasive agent, and a compound represented by Formula 3 or a complex thereof.

* The CMP slurry composition is designed specifically for polishing tungsten surfaces.
* The composition includes a compound represented by Formula 3 or a complex thereof, which aids in the polishing process.
* The use of a polar or nonpolar solvent helps in maintaining the consistency and effectiveness of the slurry during the polishing process.

== Potential Applications ==
The technology can be applied in the semiconductor industry for polishing tungsten layers in integrated circuits.

== Problems Solved ==
The technology solves the problem of achieving a smooth and uniform tungsten surface during the polishing process.

== Benefits ==
The benefits of this technology include improved efficiency in polishing tungsten surfaces, leading to enhanced performance of integrated circuits.

== Potential Commercial Applications ==
The technology can be commercially applied in semiconductor manufacturing companies for the production of high-quality integrated circuits.

== Possible Prior Art ==
One possible prior art could be the use of different CMP slurry compositions for polishing various metals in semiconductor manufacturing processes.

=== Unanswered Questions ===

=== How does the compound represented by Formula 3 enhance the polishing process of tungsten surfaces? ===
The compound represented by Formula 3 likely has specific properties that aid in the removal of material from the tungsten surface, resulting in a smoother finish. Further research and testing would be needed to fully understand its mechanism of action.

=== What are the potential environmental impacts of using this CMP slurry composition for polishing tungsten? ===
The environmental impacts of using this CMP slurry composition, such as solvent disposal and waste management, would need to be assessed to ensure compliance with regulations and minimize any negative effects on the environment.


==Original Abstract Submitted==

A CMP slurry composition for polishing tungsten and a method of polishing tungsten using the same, the composition includes a polar solvent or a nonpolar solvent; an abrasive agent; and a compound represented by Formula 3 or a complex thereof:



[[Category:C09G1/02]]
[[Category:B24B37/04]]
[[Category:C09K3/14]]