View source for 18383072. EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND simplified abstract (Samsung Electronics Co., Ltd.)

=EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:Changho Noh of Suwon-si (KR)|Changho Noh of Suwon-si (KR)]][[Category:Changho Noh of Suwon-si (KR)]]

[[:Category:Insu Lee of Hwaseong-si (KR)|Insu Lee of Hwaseong-si (KR)]][[Category:Insu Lee of Hwaseong-si (KR)]]

[[:Category:Songwon Hyun of Yongin-si (KR)|Songwon Hyun of Yongin-si (KR)]][[Category:Songwon Hyun of Yongin-si (KR)]]

[[:Category:Yoonseok Ko of Suwon-si (KR)|Yoonseok Ko of Suwon-si (KR)]][[Category:Yoonseok Ko of Suwon-si (KR)]]

[[:Category:Mijeong Kim of Hwaseong-si (KR)|Mijeong Kim of Hwaseong-si (KR)]][[Category:Mijeong Kim of Hwaseong-si (KR)]]

[[:Category:Keechang Lee of Suwon-si (KR)|Keechang Lee of Suwon-si (KR)]][[Category:Keechang Lee of Suwon-si (KR)]]

[[:Category:Sangsoo Jee of Hwaseong-si (KR)|Sangsoo Jee of Hwaseong-si (KR)]][[Category:Sangsoo Jee of Hwaseong-si (KR)]]

==EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18383072 titled 'EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND

==Simplified Explanation==

The patent application describes an epoxy compound with an aromatic ring represented by Formula 1 or Formula 2, along with compositions, semiconductor devices, electronic devices, articles, and methods prepared from the epoxy compound.

* The epoxy compound contains an aromatic ring, which can enhance the properties of the compound.
* The composition prepared from the epoxy compound can be used in various applications due to its unique properties.
* Semiconductor devices prepared from the epoxy compound may exhibit improved performance and reliability.
* Electronic devices made from the epoxy compound could benefit from its specific characteristics.
* Articles prepared from the epoxy compound may have enhanced durability and functionality.

== Potential Applications ==
The epoxy compound and its derivatives could be used in:
* Adhesives and sealants
* Coatings and paints
* Electronic packaging materials
* Printed circuit boards
* Composite materials

== Problems Solved ==
The epoxy compound addresses issues such as:
* Improving the performance of semiconductor devices
* Enhancing the properties of electronic devices
* Increasing the durability of articles made from the compound
* Providing a versatile material for various applications

== Benefits ==
The technology offers benefits such as:
* Enhanced properties due to the aromatic ring structure
* Improved performance and reliability in semiconductor devices
* Versatile applications in different industries
* Potential for creating high-quality electronic and composite materials


==Original Abstract Submitted==

An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:



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[[Category:C08K3/013]]
[[Category:C08G59/62]]
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