View source for 18380042. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:Seungryong Oh of Suwon-si (KR)|Seungryong Oh of Suwon-si (KR)]][[Category:Seungryong Oh of Suwon-si (KR)]]

[[:Category:Chajea Jo of Suwon-si (KR)|Chajea Jo of Suwon-si (KR)]][[Category:Chajea Jo of Suwon-si (KR)]]

==SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18380042 titled 'SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE

The semiconductor package described in the abstract consists of multiple layers and components, including two semiconductor chips, bonding layers, insulating layers, redistribution layers, vias, and an encapsulant.

* The first semiconductor chip has a bonding layer with a chip pad and an insulating layer covering the pad.
* The second semiconductor chip is positioned below the first chip and has a substrate with through-electrodes passing through it, protruding from the rear surface.
* The second chip's bonding layer includes a chip pad and an insulating layer.
* A redistribution layer is located below the second chip and is electrically connected to it.
* Vias are present between the redistribution layer and the first semiconductor chip, surrounding the second chip.
* An encapsulant surrounds the second chip, redistribution layer, and vias, potentially in contact with the through-electrode protrusions.

**Key Features and Innovation:**

* Multi-layered semiconductor package design with through-electrodes for electrical connections.
* Use of insulating layers to protect chip pads.
* Redistribution layer for efficient electrical connections.
* Vias for routing connections between layers.
* Encapsulant for protection and stability.

**Potential Applications:**

* Integrated circuits
* Microprocessors
* Memory modules

**Problems Solved:**

* Efficient electrical connections in a compact space
* Protection of delicate chip components
* Improved stability and reliability of semiconductor packages

**Benefits:**

* Enhanced electrical performance
* Increased durability and longevity
* Compact design for space-saving applications

**Commercial Applications:**

* Consumer electronics
* Automotive electronics
* Telecommunications equipment

**Prior Art:**

Prior research may include studies on semiconductor packaging techniques, multi-chip modules, and through-electrode designs.

**Frequently Updated Research:**

Ongoing research may focus on optimizing the design for higher performance and reliability, exploring new materials for insulating and encapsulating layers, and improving manufacturing processes for semiconductor packages.

**Questions about Semiconductor Package Design:**

1. How does the use of insulating layers benefit the semiconductor package design?
2. What are the potential challenges in manufacturing semiconductor packages with through-electrodes?


==Original Abstract Submitted==

A semiconductor package includes a first semiconductor chip including a first bonding layer, the first bonding layer including a first chip pad and a first insulating layer covering a side surface of the first chip pad, a second semiconductor chip disposed below the first semiconductor chip and including a substrate having front and rear surfaces, the front surface forming a second bonding layer, and through-electrodes passing through the substrate and having protrusions protruding from the rear surface, the second bonding layer including a second chip pad contacting the first chip pad and a second insulating layer covering a side surface of the second chip pad, a redistribution layer disposed below the second semiconductor chip and electrically connected to the second semiconductor chip, vias disposed between the redistribution layer and the first semiconductor chip and disposed around the second semiconductor chip, and an encapsulant surrounding the second semiconductor chip, the redistribution layer, and the vias. The encapsulant may be in contact with the protrusions of the through-electrodes.



[[Category:H01L23/498]]
[[Category:H01L23/00]]
[[Category:H01L25/065]]
[[Category:CPC_H01L23/49822]]