View source for 18372346. Methods Of Cooling A Vertical Line Card (Google LLC)

=Methods Of Cooling A Vertical Line Card=


==Organization Name==

[[:Category:Google LLC|Google LLC]]


[[Category:Google LLC]]

==Inventor(s)==

[[:Category:Tanya Liu of San Mateo CA US|Tanya Liu of San Mateo CA US]][[Category:Tanya Liu of San Mateo CA US]]

[[:Category:Madhusudan K. Iyengar of Foster City CA US|Madhusudan K. Iyengar of Foster City CA US]][[Category:Madhusudan K. Iyengar of Foster City CA US]]

[[:Category:Cedric Fung Lam of San Carlos CA US|Cedric Fung Lam of San Carlos CA US]][[Category:Cedric Fung Lam of San Carlos CA US]]

==Methods Of Cooling A Vertical Line Card==


This abstract first appeared for US patent application 18372346 titled 'Methods Of Cooling A Vertical Line Card

==Original Abstract Submitted==

A system for cooling a vertical line card includes a printed circuit board; an application specific integrated circuit (ASIC) having a front surface, a back surface, and an edge surface connecting the front and back surfaces, the ASIC mountable on the printed circuit board; a vapor chamber mountable on the ASIC, the vapor chamber including a first portion mountable on the front surface of the ASIC and extending away from the front surface and a second portion in fluid communication with the first portion extending away from the first portion at an angle relative to the first portion.



[[Category:H05K7/20]]
[[Category:CPC_H05K7/20409]]