View source for 18368195. 3D TAP & SCAN PORT ARCHITECTURES simplified abstract (Texas Instruments Incorporated)

=3D TAP & SCAN PORT ARCHITECTURES=


==Organization Name==

[[:Category:Texas Instruments Incorporated|Texas Instruments Incorporated]]


[[Category:Texas Instruments Incorporated]]

==Inventor(s)==

[[:Category:Lee D. Whetsel of Parker TX (US)|Lee D. Whetsel of Parker TX (US)]][[Category:Lee D. Whetsel of Parker TX (US)]]

==3D TAP & SCAN PORT ARCHITECTURES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18368195 titled '3D TAP & SCAN PORT ARCHITECTURES

==Simplified Explanation==

The abstract of this patent application describes the implementation of die test architectures in a die stack, specifically in the first, middle, and last die. These architectures are mostly the same, with a few exceptions mentioned in the disclosure.

* Die test architectures implemented in a die stack
* Specifically designed for the first, middle, and last die
* Architectures are mostly the same with a few exceptions
* Described in detail in the disclosure section of the patent application

==Potential Applications==
* Semiconductor manufacturing industry
* Die stacking technology
* Testing and quality control of die stacks

==Problems Solved==
* Standardizing die test architectures in a die stack
* Ensuring consistent testing procedures across different dies
* Addressing any exceptions or variations in the test architectures

==Benefits==
* Improved efficiency in die testing
* Streamlined testing procedures for die stacks
* Enhanced quality control measures for die stacks


==Original Abstract Submitted==

This disclosure describes die test architectures that can be implemented in a first, middle and last die of a die stack. The die test architectures are mainly the same, but for the exceptions mentioned in this disclosure.



[[Category:G01R31/317]]
[[Category:G01R31/3177]]
[[Category:G01R31/3185]]
[[Category:G01R31/28]]
[[Category:G01R31/3183]]