View source for 18367655. COVER FOR MODULE TRAY AND MODULE TRAY FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

=COVER FOR MODULE TRAY AND MODULE TRAY FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:Taegeon Kim of Suwon-si (KR)|Taegeon Kim of Suwon-si (KR)]][[Category:Taegeon Kim of Suwon-si (KR)]]

==COVER FOR MODULE TRAY AND MODULE TRAY FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18367655 titled 'COVER FOR MODULE TRAY AND MODULE TRAY FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME

==Simplified Explanation==

The abstract describes a cover for a module tray that includes a card accommodation portion to accommodate a card. The card accommodation portion consists of three brackets with accommodation guides extending in horizontal directions.

* The cover for a module tray includes a card accommodation portion with multiple brackets and accommodation guides.
* The first bracket has a first accommodation guide extending in the first horizontal direction.
* The second bracket is spaced apart from the first bracket and has second and third accommodation guides.
* The third bracket is spaced apart from the first and second brackets and has fourth and fifth accommodation guides.

== Potential Applications ==
This technology could be applied in the manufacturing of semiconductor devices, electronic components, and other devices that require secure card accommodation.

== Problems Solved ==
This innovation solves the problem of securely accommodating a card within a module tray cover, ensuring proper protection and organization of electronic components.

== Benefits ==
The benefits of this technology include improved organization, protection, and accessibility of cards within module trays, enhancing overall efficiency and functionality of electronic devices.

== Potential Commercial Applications ==
The potential commercial applications of this technology include the production of module trays for various industries such as electronics, telecommunications, and automotive.

== Possible Prior Art ==
One possible prior art could be the use of brackets and guides in electronic device covers to secure and organize components, although the specific design described in this patent application may be unique.

=== Unanswered Questions ===

== How does this technology compare to existing solutions in terms of cost-effectiveness and ease of implementation? ==
This article does not provide information on the cost-effectiveness and ease of implementation compared to existing solutions.

== What are the potential challenges or limitations of implementing this technology in different types of module trays or electronic devices? ==
This article does not address the potential challenges or limitations of implementing this technology in various types of module trays or electronic devices.


==Original Abstract Submitted==

A cover for a module tray includes a cover structure to cover a case of a semiconductor device, and a card accommodation portion on an upper surface of the cover structure to accommodate a card. The card accommodation portion includes a first bracket having a first accommodation guide extending in the first horizontal direction, a second bracket spaced apart from the first bracket and having second and third accommodation guides, the second accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the third accommodation guide extending in the second horizontal direction, and a third bracket spaced apart from the first and second brackets, and having fourth and fifth accommodation guides, the fourth accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the fifth accommodation guide extending in the second horizontal direction to face the third accommodation guide.



[[Category:H01L21/673]]
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[[Category:B65D51/24]]