View source for 18351591. INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORMED IN A CONDUCTIVE ROUTING REGION simplified abstract (Microchip Technology Incorporated)

=INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORMED IN A CONDUCTIVE ROUTING REGION=


==Organization Name==

[[:Category:Microchip Technology Incorporated|Microchip Technology Incorporated]]


[[Category:Microchip Technology Incorporated]]

==Inventor(s)==

[[:Category:Matthew Martin of Gilbert AZ (US)|Matthew Martin of Gilbert AZ (US)]][[Category:Matthew Martin of Gilbert AZ (US)]]

[[:Category:Bomy Chen of Newark CA (US)|Bomy Chen of Newark CA (US)]][[Category:Bomy Chen of Newark CA (US)]]

[[:Category:Julius Kovats of Manitou Springs CO (US)|Julius Kovats of Manitou Springs CO (US)]][[Category:Julius Kovats of Manitou Springs CO (US)]]

==INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORMED IN A CONDUCTIVE ROUTING REGION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18351591 titled 'INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORMED IN A CONDUCTIVE ROUTING REGION

==Simplified Explanation==
The patent application describes an integrated circuit package with a bare die mounted on a substrate, featuring a conductive routing region that includes an inductor.

* The conductive routing structure in the package is connected to the bare die and consists of conductive elements in multiple layers.
* The inductor is formed in at least one of these conductive routing layers.

==Key Features and Innovation==
* Integrated circuit package with a bare die and a conductive routing region.
* Conductive routing structure with multiple layers of conductive elements.
* Inductor formed within the conductive routing layers.

==Potential Applications==
This technology can be used in various electronic devices such as smartphones, computers, and IoT devices where compact and efficient integrated circuits are required.

==Problems Solved==
* Provides a compact and efficient solution for integrated circuit packaging.
* Enables the integration of inductors within the circuit design.

==Benefits==
* Improved performance and efficiency of electronic devices.
* Space-saving design for compact devices.
* Enhanced functionality with integrated inductors.

==Commercial Applications==
* This technology can be applied in the consumer electronics industry for the development of smaller and more efficient devices.
* It can also be utilized in the automotive sector for advanced electronic systems.

==Questions about Integrated Circuit Package==
===What are the potential applications of this technology in the automotive industry?===
The technology can be used in automotive electronic systems for improved performance and efficiency.

===How does the integration of inductors within the conductive routing layers benefit electronic devices?===
Integrating inductors within the routing layers enhances the functionality and efficiency of the devices.


==Original Abstract Submitted==

An integrated circuit (IC) package includes a bare die mounted on a substrate, and a conductive routing region including conductive routing structure and an inductor. The conductive routing structure is conductively connected to the bare die, and includes conductive elements formed in multiple conductive routing layers in the conductive routing region. The inductive device includes a winding formed in at least one conductive routing layer of the multiple conductive routing layers.



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