View source for 18344992. PHOTORESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION simplified abstract (Samsung Electronics Co., Ltd.)

=PHOTORESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:Chawon Koh of Suwon-si (KR)|Chawon Koh of Suwon-si (KR)]][[Category:Chawon Koh of Suwon-si (KR)]]

[[:Category:Sungkun Kang of Suwon-si (KR)|Sungkun Kang of Suwon-si (KR)]][[Category:Sungkun Kang of Suwon-si (KR)]]

[[:Category:Tsunehiro Nishi of Suwon-si (KR)|Tsunehiro Nishi of Suwon-si (KR)]][[Category:Tsunehiro Nishi of Suwon-si (KR)]]

[[:Category:Young Joo Choi of Suwon-si (KR)|Young Joo Choi of Suwon-si (KR)]][[Category:Young Joo Choi of Suwon-si (KR)]]

==PHOTORESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18344992 titled 'PHOTORESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION

The disclosed patent application relates to photoresist topcoat compositions used in forming patterns in semiconductor manufacturing processes. These compositions include a polymer with specific structural units, a thermal acid generator (TAG), and a solvent. The method involves applying this composition to a substrate to protect it during the patterning process.

* The patent application introduces photoresist topcoat compositions with specific polymer structural units, TAG, and solvent.
* These compositions are designed to improve the patterning process in semiconductor manufacturing.
* The method outlined in the patent involves applying the composition to a substrate to protect it during patterning.
* The innovation aims to enhance the precision and efficiency of pattern formation in semiconductor manufacturing.
* By utilizing these specific components, the photoresist topcoat compositions offer improved performance and reliability in the fabrication process.

== Potential Applications ==
The technology described in the patent application can be applied in the semiconductor industry for the production of advanced electronic devices. It can also be utilized in other industries that require precise patterning processes, such as microelectronics and nanotechnology.

== Problems Solved ==
This technology addresses the challenges faced in semiconductor manufacturing processes, such as achieving high-resolution patterns with improved accuracy and reliability. The specific composition of the photoresist topcoat helps in protecting the substrate during the patterning process, leading to better outcomes.

== Benefits ==
- Enhanced precision and accuracy in pattern formation
- Improved reliability and performance in semiconductor manufacturing
- Increased efficiency in the fabrication process
- Potential cost savings due to reduced material wastage and rework

== Commercial Applications ==
The technology has significant commercial potential in the semiconductor industry, where precise patterning is crucial for the production of advanced electronic devices. It can also be valuable in research institutions and companies working on microelectronics and nanotechnology applications.

== Questions about the Technology ==
1. How does the specific polymer structure in the composition contribute to the effectiveness of the photoresist topcoat?
2. What are the potential implications of using this technology in other industries beyond semiconductor manufacturing?


==Original Abstract Submitted==

Disclosed photoresist topcoat compositions including a polymer including at least one of the first structural units represented by Chemical Formula 1 or Chemical Formula 2, a thermal acid generator (TAG), and a solvent; and a method of forming patterns using the photoresist topcoat composition.



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