View source for 18340193. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)

=SEMICONDUCTOR PACKAGES=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:Eunsu Lee of Suwon-si (KR)|Eunsu Lee of Suwon-si (KR)]][[Category:Eunsu Lee of Suwon-si (KR)]]

==SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18340193 titled 'SEMICONDUCTOR PACKAGES

The semiconductor package described in the abstract includes a front redistribution structure with multiple redistribution layers and connection bumps within a recess, as well as an underfill material.

* The front redistribution structure consists of an insulating layer with front redistribution layers, including a first layer on a lower level and second layers on a higher level.
* The connection bumps include a first bump connected to the first redistribution layer and a second bump connected to the outer redistribution layer within the recess.
* The underfill extends along the side surfaces of the second bump and a dam within the recess.

Potential Applications:
- This semiconductor package design can be used in various electronic devices such as smartphones, tablets, and computers.
- It can also be applied in automotive electronics, industrial machinery, and medical devices.

Problems Solved:
- Provides improved electrical connections within the semiconductor package.
- Enhances the reliability and performance of electronic devices.

Benefits:
- Increased efficiency and functionality of electronic devices.
- Enhanced durability and longevity of semiconductor packages.

Commercial Applications:
- This technology can be utilized by semiconductor manufacturers, electronics companies, and other industries requiring advanced packaging solutions.

Questions about Semiconductor Package Design:
1. How does the front redistribution structure contribute to the overall performance of the semiconductor package?
2. What are the specific advantages of using connection bumps within a recess in this design?


==Original Abstract Submitted==

A semiconductor package including: a front redistribution structure including an insulating layer defining an upper surface, a lower surface opposing the upper surface, and a side surface, front redistribution layers including a first redistribution layer on a first level adjacent to the lower surface and second redistribution layers on a second level higher than the first level relative to the lower surface, the second redistribution layers having an inner redistribution layer and an outer redistribution layer, a recess exposing at least a portion of the outer redistribution layer, and a dam on at least one side of the recess; connection bumps including a first bump electrically connected to the first redistribution layer and a second bump electrically connected to the outer redistribution layer within the recess; and an underfill that extends along a side surface of the second bump and a side surface of the dam within the recess.



[[Category:H01L23/498]]
[[Category:H01L21/48]]
[[Category:H01L25/10]]
[[Category:H10B80/00]]
[[Category:CPC_H01L23/49838]]