View source for 18320455. MEMORY STACK STRUCTURE INCLUDING POWER DISTRIBUTION STRUCTURES AND A HIGH-BANDWIDTH MEMORY INCLUDING THE MEMORY STACK STRUCTURE simplified abstract (SK hynix Inc.)

=MEMORY STACK STRUCTURE INCLUDING POWER DISTRIBUTION STRUCTURES AND A HIGH-BANDWIDTH MEMORY INCLUDING THE MEMORY STACK STRUCTURE=


==Organization Name==

[[:Category:SK hynix Inc.|SK hynix Inc.]]


[[Category:SK hynix Inc.]]

==Inventor(s)==

[[:Category:Je Min Bang of Icheon-si (KR)|Je Min Bang of Icheon-si (KR)]][[Category:Je Min Bang of Icheon-si (KR)]]

[[:Category:Bum Su Kim of Icheon-si (KR)|Bum Su Kim of Icheon-si (KR)]][[Category:Bum Su Kim of Icheon-si (KR)]]

[[:Category:Jin Ho Kim of Icheon-si (KR)|Jin Ho Kim of Icheon-si (KR)]][[Category:Jin Ho Kim of Icheon-si (KR)]]

[[:Category:Jea Hoon Park of Icheon-si (KR)|Jea Hoon Park of Icheon-si (KR)]][[Category:Jea Hoon Park of Icheon-si (KR)]]

==MEMORY STACK STRUCTURE INCLUDING POWER DISTRIBUTION STRUCTURES AND A HIGH-BANDWIDTH MEMORY INCLUDING THE MEMORY STACK STRUCTURE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18320455 titled 'MEMORY STACK STRUCTURE INCLUDING POWER DISTRIBUTION STRUCTURES AND A HIGH-BANDWIDTH MEMORY INCLUDING THE MEMORY STACK STRUCTURE

The abstract describes a memory stack structure consisting of multiple memory dies stacked over each other, connected by signal transmission and power distribution structures.

* The memory stack structure includes a base die, bottom memory die, intermediate memory die, and top memory die stacked in that order.
* Signal transmission structure electrically connects all the memory dies to each other.
* First power distribution structure connects the base die to the bottom memory die.
* Second power distribution structure connects the bottom memory die, intermediate memory die, and top memory die to each other.

Potential Applications:
- This technology can be used in high-performance computing systems.
- It can also be applied in data centers for efficient data storage and processing.

Problems Solved:
- Enables compact and efficient memory storage in a stacked configuration.
- Facilitates faster data transmission and power distribution within the memory stack.

Benefits:
- Increased memory capacity in a smaller footprint.
- Enhanced data processing speed and efficiency.

Commercial Applications:
Title: "Innovative Memory Stack Structure for High-Performance Computing Systems"
This technology can be utilized in servers, supercomputers, and other high-performance computing systems to improve data processing capabilities and overall performance.

Questions about the technology:
1. How does this memory stack structure compare to traditional memory configurations?
   - The memory stack structure offers increased memory capacity and faster data processing compared to traditional configurations.
2. What are the potential challenges in implementing this technology in real-world applications?
   - Some challenges may include thermal management due to the compact stacking of memory dies and ensuring reliable signal transmission and power distribution.


==Original Abstract Submitted==

A memory stack structure incudes a base die; a bottom memory die stacked over the base die; an intermediate memory die stacked over the bottom memory die; a top memory die stacked over the intermediate memory die; a signal transmission structure electrically connecting the base die, the bottom memory die, the intermediate memory die, and the top memory die to each other; a first power distribution structure electrically connecting the base die to the bottom memory die; and a second power distribution structure electrically connecting the bottom memory die, the intermediate memory die, and the top memory die to each other.



[[Category:H01L25/065]]
[[Category:H01L23/00]]
[[Category:H01L23/498]]
[[Category:H10B80/00]]
[[Category:CPC_H01L25/0657]]