View source for 18315432. SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT simplified abstract (SK hynix Inc.)

=SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT=


==Organization Name==

[[:Category:SK hynix Inc.|SK hynix Inc.]]


[[Category:SK hynix Inc.]]

==Inventor(s)==

[[:Category:Young Ock Hong of Icheon-si Gyeonggi-do (KR)|Young Ock Hong of Icheon-si Gyeonggi-do (KR)]][[Category:Young Ock Hong of Icheon-si Gyeonggi-do (KR)]]

==SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18315432 titled 'SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT

==Simplified Explanation==

The semiconductor device described in the abstract includes a defect detection circuit that connects upper and lower bonding pads through lines and a detection circuit.

* The semiconductor device has a plurality of upper bonding pads and lower bonding pads adhered to each other.
* A first upper line connects upper bonding pads to each other.
* A plurality of lower lines are connected to the lower bonding pads.
* The first defect detection circuit includes an input terminal connected to a lower line and an output terminal connected to another lower line.

== Potential Applications ==
This technology could be used in the manufacturing and testing of semiconductor devices to detect defects in the bonding pads and lines.

== Problems Solved ==
This technology helps in identifying defects in the bonding pads and lines of semiconductor devices, ensuring the quality and reliability of the devices.

== Benefits ==
The defect detection circuit improves the overall quality control process in semiconductor manufacturing, leading to more reliable and efficient devices.

== Potential Commercial Applications ==
"Improving Quality Control in Semiconductor Manufacturing with Defect Detection Circuits"

== Possible Prior Art ==
There may be prior art related to defect detection circuits in semiconductor devices, but specific examples are not provided in this abstract.

=== Unanswered Questions ===

=== How does the defect detection circuit identify and differentiate between various types of defects in the bonding pads and lines of the semiconductor device? ===
The abstract does not provide details on the specific mechanisms or techniques used by the defect detection circuit to identify different types of defects.

=== What is the impact of implementing this defect detection circuit on the overall cost and efficiency of semiconductor manufacturing processes? ===
The abstract does not address the potential cost implications or efficiency improvements that may result from integrating this defect detection circuit into semiconductor manufacturing processes.


==Original Abstract Submitted==

There is provided a semiconductor device having a defect detection circuit. The semiconductor device includes a plurality of upper bonding pads, a plurality of lower bonding pads adhered to the plurality of upper bonding pads, a first upper line electrically connecting upper bonding pads, among the plurality of upper bonding pads, to each other; a plurality of lower lines electrically connected to the plurality of lower bonding pads; and a first defect detection circuit including an input terminal connected to a lower line, among the plurality of lower lines and an output terminal connected to another lower line, among the plurality of lower lines.



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