View source for 18282909. NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, PREPARATION METHOD OF CURED PRODUCT, HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT simplified abstract (Toray Industries, Inc.)

=NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, PREPARATION METHOD OF CURED PRODUCT, HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT=


==Organization Name==

[[:Category:Toray Industries, Inc.|Toray Industries, Inc.]]


[[Category:Toray Industries, Inc.]]

==Inventor(s)==

[[:Category:Kenta Aoshima of Otsu-shi (JP)|Kenta Aoshima of Otsu-shi (JP)]][[Category:Kenta Aoshima of Otsu-shi (JP)]]

[[:Category:Yutaro Koyama of Otsu-shi (JP)|Yutaro Koyama of Otsu-shi (JP)]][[Category:Yutaro Koyama of Otsu-shi (JP)]]

[[:Category:Kazuyuki Matsumura of Otsu-shi (JP)|Kazuyuki Matsumura of Otsu-shi (JP)]][[Category:Kazuyuki Matsumura of Otsu-shi (JP)]]

[[:Category:Hitoshi Araki of Otsu-shi (JP)|Hitoshi Araki of Otsu-shi (JP)]][[Category:Hitoshi Araki of Otsu-shi (JP)]]

==NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, PREPARATION METHOD OF CURED PRODUCT, HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18282909 titled 'NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, PREPARATION METHOD OF CURED PRODUCT, HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT

==Simplified Explanation==

The negative type photosensitive resin composition described in the abstract is designed to have high aspect ratio pattern processability, high storage stability, high curability, and produce a cured product with good mechanical characteristics and high heat resistance.

* The composition includes a polymer compound (A), a cationic polymerizable compound (B), a cationic polymerization initiator (C), and a solvent (D).
* Component (A) contains at least one compound selected from polyamide, polyimide, polybenzoxazole, precursors thereof, and copolymers thereof.
* The composition satisfies the relations 0.6A≤B+0.5C≤0.98A and 0.05(B+C)≤C≤0.25(B+C), where A (moles), B (moles), and C (moles) represent the quantities of carboxylic acid residues, diamine residues, and monoamine residues in component (A).

== Potential Applications ==
This technology could be applied in the manufacturing of high-performance electronic devices, microelectronics, and microelectromechanical systems (MEMS).

== Problems Solved ==
This technology solves the problem of achieving high aspect ratio pattern processability while maintaining high storage stability and producing a cured product with excellent mechanical characteristics and high heat resistance.

== Benefits ==
The benefits of this technology include improved processability, storage stability, mechanical characteristics, and heat resistance in the production of microscale patterns and structures.

== Potential Commercial Applications ==
The potential commercial applications of this technology could be in the semiconductor industry, microfabrication, and other high-precision manufacturing sectors.

== Possible Prior Art ==
One possible prior art could be the use of similar negative type photosensitive resin compositions in the production of microscale patterns and structures. However, the specific combination of components and the defined relations as described in this patent application may be novel.

=== Unanswered Questions ===

=== How does this technology compare to existing negative type photosensitive resin compositions in terms of pattern resolution and processability? ===
This article does not provide a direct comparison with existing negative type photosensitive resin compositions in terms of pattern resolution and processability. Further research or testing may be needed to evaluate the performance of this technology against existing alternatives.

=== What are the potential environmental impacts of using this negative type photosensitive resin composition in manufacturing processes? ===
The article does not address the potential environmental impacts of using this negative type photosensitive resin composition in manufacturing processes. It would be important to consider any environmental implications, such as waste generation or chemical emissions, associated with the use of this technology.


==Original Abstract Submitted==

It is intended to provide a negative type photosensitive resin composition that ensures high aspect ratio pattern processability, high storage stability, and high curability and also provides a cured product with good mechanical characteristics and high heat resistance. A negative type photosensitive resin composition comprising a polymer compound (A), a cationic polymerizable compound (B), a cationic polymerization initiator (C), and a solvent (D) wherein the component (A) contains at least one compound selected from the group consisting of polyamide, polyimide, polybenzoxazole, precursors thereof, and copolymers thereof and wherein both the relations 0.6A≤B+0.5C≤0.98A and 0.05(B+C)≤C≤0.25(B+C) are satisfied where A (moles), B (moles), and C (moles) represent the quantities of all carboxylic acid residues, all diamine residues, and all monoamine residues, respectively, contained in the component (A).



[[Category:G03F7/037]]
[[Category:C08G69/26]]
[[Category:C08G73/10]]
[[Category:C08G73/22]]