View source for 18281910. DEVICE MODULE simplified abstract (SUMITOMO WIRING SYSTEMS, LTD.)

=DEVICE MODULE=


==Organization Name==

[[:Category:SUMITOMO WIRING SYSTEMS, LTD.|SUMITOMO WIRING SYSTEMS, LTD.]]


[[Category:SUMITOMO WIRING SYSTEMS, LTD.]]

==Inventor(s)==

[[:Category:Tatsumi Sato of Osaka (JP)|Tatsumi Sato of Osaka (JP)]][[Category:Tatsumi Sato of Osaka (JP)]]

[[:Category:Kosuke Sone of Osaka (JP)|Kosuke Sone of Osaka (JP)]][[Category:Kosuke Sone of Osaka (JP)]]

[[:Category:Yasuyuki Yamamoto of Osaka (JP)|Yasuyuki Yamamoto of Osaka (JP)]][[Category:Yasuyuki Yamamoto of Osaka (JP)]]

[[:Category:Takuya Taniguchi of Osaka (JP)|Takuya Taniguchi of Osaka (JP)]][[Category:Takuya Taniguchi of Osaka (JP)]]

[[:Category:Ai Takehisa of Osaka (JP)|Ai Takehisa of Osaka (JP)]][[Category:Ai Takehisa of Osaka (JP)]]

==DEVICE MODULE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18281910 titled 'DEVICE MODULE

The patent application aims to provide a technique for cooling a device without the need for it to be housed inside a duct.

* A device module includes a support member located in a vehicle's roof inner space between a roof panel and an interior member.
* The device is supported by a support surface on the support member, creating a support-member-side flow path inside the support member.
* The support-member-side flow path is connected to a duct-side flow path in a duct in the vehicle.

Potential Applications:
- Automotive industry for cooling electronic devices in vehicles
- Aerospace industry for cooling equipment in aircraft
- Industrial applications for cooling machinery in tight spaces

Problems Solved:
- Eliminates the need for bulky ducts to cool devices
- Provides a more efficient cooling solution in confined spaces

Benefits:
- Space-saving design
- Improved cooling efficiency
- Simplified installation process

Commercial Applications:
Cooling systems for vehicles, aircraft, industrial machinery

Questions about the technology:
1. How does this cooling technique compare to traditional duct-based systems?
2. What are the potential cost savings associated with implementing this technology?

Frequently Updated Research:
Research on advanced cooling techniques in the automotive and aerospace industries.


==Original Abstract Submitted==

One aim is to provide a technique allowing a device to be cooled without being housed inside a duct. A device module includes: a support member that is disposed in a roof inner space that is located between a roof panel and an interior member in a vehicle; and a device that is supported by a support surface among outer surfaces of the support member. A support-member-side flow path is formed inside the support member, and the support-member-side flow path is connected to a duct-side flow path in a duct in the vehicle.



[[Category:B60H1/26]]
[[Category:B60H1/00]]
[[Category:CPC_B60H1/262]]