View source for 18273446. APPARATUS FOR TRANSFERRING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND METHOD OF PROCESSING SUBSTRATE simplified abstract (Tokyo Electron Limited)

=APPARATUS FOR TRANSFERRING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND METHOD OF PROCESSING SUBSTRATE=


==Organization Name==

[[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]


[[Category:Tokyo Electron Limited]]

==Inventor(s)==

[[:Category:Takehiro Shindo of Nirasaki City, Yamanashi (JP)|Takehiro Shindo of Nirasaki City, Yamanashi (JP)]][[Category:Takehiro Shindo of Nirasaki City, Yamanashi (JP)]]

[[:Category:Akinori Shimamura of Nirasaki City, Yamanashi (JP)|Akinori Shimamura of Nirasaki City, Yamanashi (JP)]][[Category:Akinori Shimamura of Nirasaki City, Yamanashi (JP)]]

[[:Category:Hiromitsu Sakaue of Nirasaki City, Yamanashi (JP)|Hiromitsu Sakaue of Nirasaki City, Yamanashi (JP)]][[Category:Hiromitsu Sakaue of Nirasaki City, Yamanashi (JP)]]

[[:Category:Dongwei Li of Nirasaki City, Yamanashi (JP)|Dongwei Li of Nirasaki City, Yamanashi (JP)]][[Category:Dongwei Li of Nirasaki City, Yamanashi (JP)]]

==APPARATUS FOR TRANSFERRING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND METHOD OF PROCESSING SUBSTRATE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18273446 titled 'APPARATUS FOR TRANSFERRING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND METHOD OF PROCESSING SUBSTRATE

==Simplified Explanation==

The patent application describes an apparatus that uses magnetic levitation to transfer a substrate inside a substrate transfer chamber. The apparatus includes a substrate transfer chamber with a floor portion containing a first magnet, connected to a substrate processing chamber, and a substrate transfer module with a substrate holder and a second magnet creating a repulsive force for movement inside the chamber.

* Explanation of the patent/innovation:
- Apparatus for substrate transfer using magnetic levitation
- Substrate transfer module with magnets for movement inside the chamber
- Direct loading/unloading of substrate or transfer to/from a fixed substrate transfer mechanism

Potential applications of this technology:
- Semiconductor manufacturing
- Thin film deposition processes
- Solar panel production

Problems solved by this technology:
- Precise and controlled substrate transfer
- Minimization of contamination risks
- Efficient loading/unloading processes

Benefits of this technology:
- Increased productivity and efficiency
- Improved substrate handling accuracy
- Reduced maintenance and downtime

Potential commercial applications of this technology:
- Semiconductor industry automation
- Advanced manufacturing facilities
- Research and development laboratories

Possible prior art:
- Magnetic levitation systems for transportation
- Automated substrate handling systems in manufacturing

Unanswered questions:
1. How does the magnetic levitation system ensure precise positioning of the substrate during transfer?
2. What are the limitations of the substrate transfer module in terms of substrate size and weight capacity?


==Original Abstract Submitted==

Provided is an apparatus that transfers a substrate inside a substrate transfer chamber by a substrate transfer module using magnetic levitation. The apparatus includes: a substrate transfer chamber having a floor portion provided with a first magnet and connected, through an opening portion, to a substrate processing chamber in which the substrate is processed; and a substrate transfer module including a substrate holder configured to hold the substrate, and a second magnet configured such that a repulsive force acts between the first magnet and the second magnet. The substrate transfer module is movable inside the substrate transfer chamber by the magnetic levitation based on the repulsive force. The substrate transfer module performs loading/unloading of the substrate by directly entering into the substrate transfer chamber via the opening portion, or delivers the substrate to and from a substrate transfer mechanism fixedly provided inside the substrate transfer chamber.



[[Category:H01L21/677]]
[[Category:H01L21/67]]