View source for 18268333. COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING COMPOSITE MATERIAL simplified abstract (Sumitomo Electric Industries, Ltd.)

=COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING COMPOSITE MATERIAL=


==Organization Name==

[[:Category:Sumitomo Electric Industries, Ltd.|Sumitomo Electric Industries, Ltd.]]


[[Category:Sumitomo Electric Industries, Ltd.]]

==Inventor(s)==

[[:Category:Toru Maeda of Osaka (JP)|Toru Maeda of Osaka (JP)]][[Category:Toru Maeda of Osaka (JP)]]

[[:Category:Miki Miyanaga of Osaka (JP)|Miki Miyanaga of Osaka (JP)]][[Category:Miki Miyanaga of Osaka (JP)]]

[[:Category:Daisuke Kondo of Osaka (JP)|Daisuke Kondo of Osaka (JP)]][[Category:Daisuke Kondo of Osaka (JP)]]

[[:Category:Kei Hirai of Osaka (JP)|Kei Hirai of Osaka (JP)]][[Category:Kei Hirai of Osaka (JP)]]

[[:Category:Masayuki Ito of Yamagata (JP)|Masayuki Ito of Yamagata (JP)]][[Category:Masayuki Ito of Yamagata (JP)]]

[[:Category:Shin-ichi Yamagata of Yamagata (JP)|Shin-ichi Yamagata of Yamagata (JP)]][[Category:Shin-ichi Yamagata of Yamagata (JP)]]

==COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING COMPOSITE MATERIAL - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18268333 titled 'COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING COMPOSITE MATERIAL

The abstract describes a composite material with a plate shape, consisting of alternating layers of copper and molybdenum powder compact impregnated with copper.

* The composite material has a first surface and a second surface, with layers of copper located at both surfaces.
* The molybdenum powder compact layer is impregnated with copper.
* Each copper layer experiences a compressive residual stress of 50 MPa or less.
* The layers are alternately layered along the thickness direction of the material.

Potential Applications:
- Electronic components
- Heat sinks
- Aerospace industry

Problems Solved:
- Enhancing thermal conductivity
- Improving mechanical strength

Benefits:
- Increased performance of electronic devices
- Enhanced durability
- Improved heat dissipation

Commercial Applications:
- Manufacturing of electronic devices
- Aerospace engineering
- Thermal management systems

Questions about the technology:
1. How does the alternating layer structure improve the properties of the composite material?
2. What are the specific advantages of using molybdenum powder compact impregnated with copper in this composite material?


==Original Abstract Submitted==

A composite material has a plate shape and has a first surface and a second surface. The second surface is opposite to the first surface. The composite material includes a plurality of first layers and at least one second layer. The first layers and the second layer are alternately layered along a thickness direction of the composite material such that the first layers are located at the first surface and the second surface. Each of the first layers is a layer including copper. The second layer is a layer of a molybdenum powder compact impregnated with copper. A compressive residual stress of 50 MPa or less acts on each of the first layer located at the first surface and the first layer located at the second surface.



[[Category:H01L23/373]]
[[Category:B22F7/04]]
[[Category:B32B15/01]]
[[Category:H01L21/48]]
[[Category:CPC_H01L23/3735]]