View source for 18256767. THERMOELECTRIC ELEMENT simplified abstract (LG INNOTEK CO., LTD.)

=THERMOELECTRIC ELEMENT=


==Organization Name==

[[:Category:LG INNOTEK CO., LTD.|LG INNOTEK CO., LTD.]]


[[Category:LG INNOTEK CO., LTD.]]

==Inventor(s)==

[[:Category:In Seok Kang of Seoul (KR)|In Seok Kang of Seoul (KR)]][[Category:In Seok Kang of Seoul (KR)]]

==THERMOELECTRIC ELEMENT - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18256767 titled 'THERMOELECTRIC ELEMENT

==Simplified Explanation==

The patent application describes a thermoelectric element with a unique structure for improved performance and efficiency. 

* The thermoelectric element includes an electrode, a semiconductor structure, a diffusion barrier layer with an opening, a metal layer, and a conductive bonding layer.
* The metal layer extends into the opening of the diffusion barrier layer to establish electrical connection with the semiconductor structure.

== Potential Applications ==
The technology could be applied in various fields such as energy harvesting, waste heat recovery, and temperature regulation systems.

== Problems Solved ==
This innovation addresses issues related to thermal management, energy efficiency, and heat transfer in electronic devices and systems.

== Benefits ==
The thermoelectric element offers enhanced performance, increased efficiency, and improved reliability compared to traditional designs.

== Potential Commercial Applications ==
The technology could be utilized in automotive, aerospace, consumer electronics, and industrial sectors for energy-efficient solutions.

== Possible Prior Art ==
Prior art may include traditional thermoelectric elements with simpler structures and lower efficiency compared to the described innovation.

=== Unanswered Questions ===

=== How does this thermoelectric element compare to existing technologies in terms of cost-effectiveness and scalability? ===

The article does not provide information on the cost-effectiveness and scalability of the described thermoelectric element compared to existing technologies. Further research and analysis would be needed to address these aspects.

=== What are the specific materials used in the construction of this thermoelectric element and how do they contribute to its performance? ===

The article does not detail the specific materials used in the construction of the thermoelectric element or how they impact its performance. Understanding the materials and their properties would be crucial for optimizing the design and functionality of the element.


==Original Abstract Submitted==

According to an embodiment, disclosed is a thermoelectric element comprising: an electrode; a semiconductor structure arranged on the electrode; a diffusion barrier layer arranged on the bottom surface of the semiconductor structure, and having an opening part; a metal layer arranged on the bottom surface of the diffusion barrier layer; and a conductive bonding layer arranged between the metal layer and the electrode, wherein a part of the metal layer extends to the inside of the opening part of the diffusion barrier layer so as to be electrically connected to the semiconductor structure.



[[Category:H10N10/817]]
[[Category:H10N10/17]]