View source for 18243726. SEMICONDUCTOR DEVICES simplified abstract (Samsung Electronics Co., Ltd.)

=SEMICONDUCTOR DEVICES=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:KYUNGHWAN Lee of Suwon-si (KR)|KYUNGHWAN Lee of Suwon-si (KR)]][[Category:KYUNGHWAN Lee of Suwon-si (KR)]]

[[:Category:YONGSEOK Kim of Suwon-si (KR)|YONGSEOK Kim of Suwon-si (KR)]][[Category:YONGSEOK Kim of Suwon-si (KR)]]

[[:Category:JEON IL Lee of Suwon-Si (KR)|JEON IL Lee of Suwon-Si (KR)]][[Category:JEON IL Lee of Suwon-Si (KR)]]

[[:Category:DAEWON Ha of Suwon-si (KR)|DAEWON Ha of Suwon-si (KR)]][[Category:DAEWON Ha of Suwon-si (KR)]]

==SEMICONDUCTOR DEVICES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18243726 titled 'SEMICONDUCTOR DEVICES

The semiconductor device described in the patent application consists of first and second stacks alternately arranged on a substrate, along with first and second pads connecting these stacks. Each stack includes a gate electrode, channel patterns, and conductive lines.

* The first and second stacks are arranged in a parallel direction on the substrate, with the first and second pads connecting them.
* Channel patterns in each stack enclose the gate electrode and are spaced apart from each other.
* The conductive lines in the stacks are connected to the corresponding channel patterns.
* The second stack's conductive lines are positioned adjacent to those of the first stack.
* The first and second pads are connected to the conductive lines in the stacks.

Potential Applications:
- This technology can be used in the manufacturing of advanced semiconductor devices for various electronic applications.
- It can enhance the performance and efficiency of integrated circuits in electronic devices.

Problems Solved:
- Improved connectivity and functionality in semiconductor devices.
- Enhanced performance and reliability of electronic components.

Benefits:
- Increased efficiency and speed in electronic devices.
- Enhanced functionality and connectivity in semiconductor devices.

Commercial Applications:
- This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and other consumer electronics.
- It can also find applications in industries requiring advanced semiconductor technology, such as telecommunications and automotive.

Questions about the technology:
1. How does the arrangement of the first and second stacks contribute to the overall performance of the semiconductor device?
2. What are the specific advantages of connecting the first and second pads to the conductive lines in the stacks?

Frequently Updated Research:
- Stay updated on the latest advancements in semiconductor technology and manufacturing processes to enhance the efficiency and performance of electronic devices.


==Original Abstract Submitted==

A semiconductor device may include first stacks and second stacks, which are alternately disposed on a substrate in a first direction parallel to a top surface of the substrate, and first pads and second pads connecting the first stacks to the second stacks. Each of the first and second stacks may include a gate electrode, channel patterns, which enclose a side surface of the gate electrode and are spaced apart from each other, and first and second conductive lines connected to a corresponding channel pattern. The first and second conductive lines of the second stack may be disposed to be adjacent to the first and second conductive lines, respectively, of the first stack. The first and second pads may be connected to the first and second conductive lines, respectively, of the first and second stacks.



[[Category:H10B51/20]]
[[Category:H01L21/28]]
[[Category:H01L23/528]]
[[Category:H01L29/51]]
[[Category:H01L29/78]]
[[Category:H10B51/10]]
[[Category:CPC_H10B51/20]]