View source for 18216860. CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

=CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD=


==Organization Name==

[[:Category:SAMSUNG ELECTRO-MECHANICS CO., LTD.|SAMSUNG ELECTRO-MECHANICS CO., LTD.]]


[[Category:SAMSUNG ELECTRO-MECHANICS CO., LTD.]]

==Inventor(s)==

[[:Category:Kyehwan Lee of Suwon-si (KR)|Kyehwan Lee of Suwon-si (KR)]][[Category:Kyehwan Lee of Suwon-si (KR)]]

==CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18216860 titled 'CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

==Simplified Explanation==

The circuit board described in the patent application includes a first insulating layer, a second insulating layer, and pad portions with different thicknesses partially buried in the first insulating layer.

* The circuit board has a first insulating layer and a second insulating layer.
* The pad portions are partially buried in the first insulating layer and protrude from the second insulating layer.
* The pad portions have different thicknesses.
* Each pad portion consists of a first layer and a second layer on top of the first layer.
* The heights of the first layers of the pad portions are lower than the height of the first insulating layer.

== Potential Applications ==
The technology described in the patent application could be applied in:
* Electronics manufacturing
* Printed circuit board design
* Semiconductor industry

== Problems Solved ==
This technology helps in:
* Improving circuit board design
* Enhancing signal transmission
* Increasing component density on circuit boards

== Benefits ==
The benefits of this technology include:
* Better signal integrity
* Increased reliability
* Enhanced performance of electronic devices

== Potential Commercial Applications ==
The technology could be commercially applied in:
* Consumer electronics
* Telecommunications equipment
* Automotive electronics

== Possible Prior Art ==
One possible prior art related to this technology is the use of multilayer circuit boards with buried components to improve signal integrity and reduce interference.

=== What are the specific materials used in the pad portions of the circuit board described in the patent application? ===
The specific materials used in the pad portions are not mentioned in the abstract. 

=== How does the different thickness of the pad portions contribute to the overall performance of the circuit board? ===
The abstract does not provide details on how the different thickness of the pad portions affects the performance of the circuit board.


==Original Abstract Submitted==

A circuit board includes: a first insulating layer; a second insulating layer positioned on the first insulating layer; and a first pad portion and a second pad portion which are partially buried in the first insulating layer, protrude from the second insulating layer, and have different thicknesses. The first pad portion and the second pad portion each include a first layer and a second layer positioned on the first layer, and heights of the first layer of the first pad portion and the first layer of the second pad portion are lower than a height of the first insulating layer.



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