View source for 18209434. THERMAL CONDUCTIVITY IN INTEGRATED CIRCUITS (Intel Corporation)

=THERMAL CONDUCTIVITY IN INTEGRATED CIRCUITS=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Lei Jiang of Camas WA (US)|Lei Jiang of Camas WA (US)]][[Category:Lei Jiang of Camas WA (US)]]

[[:Category:Daniel Christensen of Portland OR (US)|Daniel Christensen of Portland OR (US)]][[Category:Daniel Christensen of Portland OR (US)]]

[[:Category:Daniel Pantuso of Portland OR (US)|Daniel Pantuso of Portland OR (US)]][[Category:Daniel Pantuso of Portland OR (US)]]

[[:Category:Kambiz Komeyli of Portland OR (US)|Kambiz Komeyli of Portland OR (US)]][[Category:Kambiz Komeyli of Portland OR (US)]]

[[:Category:Jeffrey Hicks of Banks OR (US)|Jeffrey Hicks of Banks OR (US)]][[Category:Jeffrey Hicks of Banks OR (US)]]

[[:Category:Manjunath Shamanna of Austin TX (US)|Manjunath Shamanna of Austin TX (US)]][[Category:Manjunath Shamanna of Austin TX (US)]]

==THERMAL CONDUCTIVITY IN INTEGRATED CIRCUITS==


This abstract first appeared for US patent application 18209434 titled 'THERMAL CONDUCTIVITY IN INTEGRATED CIRCUITS




==Original Abstract Submitted==

Disclosed is an integrated circuit with a metallization stack that has thermal tower assemblages formed from wires in two or more metal layers to assist in dissipating heat out of the metallization stack.



[[Category:G06F30/392]]
[[Category:G06F30/394]]
[[Category:CPC_G06F30/392]]