View source for 18179669. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)

=SEMICONDUCTOR DEVICE=


==Organization Name==

[[:Category:KABUSHIKI KAISHA TOSHIBA|KABUSHIKI KAISHA TOSHIBA]]


[[Category:KABUSHIKI KAISHA TOSHIBA]]

==Inventor(s)==

[[:Category:Shunsuke Kamiya of Nonoichi Ishikawa (JP)|Shunsuke Kamiya of Nonoichi Ishikawa (JP)]][[Category:Shunsuke Kamiya of Nonoichi Ishikawa (JP)]]

[[:Category:Shinya Ozawa of Kanazawa Ishikawa (JP)|Shinya Ozawa of Kanazawa Ishikawa (JP)]][[Category:Shinya Ozawa of Kanazawa Ishikawa (JP)]]

[[:Category:Shuji Eguma of Hakusan Ishikawa (JP)|Shuji Eguma of Hakusan Ishikawa (JP)]][[Category:Shuji Eguma of Hakusan Ishikawa (JP)]]

[[:Category:Masaru Izumisawa of Kanazawa Ishikawa (JP)|Masaru Izumisawa of Kanazawa Ishikawa (JP)]][[Category:Masaru Izumisawa of Kanazawa Ishikawa (JP)]]

==SEMICONDUCTOR DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18179669 titled 'SEMICONDUCTOR DEVICE

==Simplified Explanation==

The semiconductor device described in the patent application includes a base member with a protrusion on one surface and a semiconductor chip mounted on the opposite surface. The semiconductor chip has electrodes, a control pad, and a semiconductor part with a space between the electrodes and the control pad. The chip is mounted so that the space overlaps the protrusion of the base member.

* Explanation of the patent/innovation:
  * Base member with a protrusion and semiconductor chip mounted on opposite surface
  * Semiconductor chip with electrodes, control pad, and semiconductor part
  * Space between electrodes and control pad on semiconductor chip
  * Chip mounted so that space overlaps base member's protrusion

* Potential applications of this technology:
  * Semiconductor devices
  * Electronics manufacturing
  * Integrated circuits

* Problems solved by this technology:
  * Improved mounting of semiconductor chips
  * Enhanced electrical connections
  * Space optimization in semiconductor devices

* Benefits of this technology:
  * Increased efficiency in electronic devices
  * Enhanced performance of semiconductor chips
  * Improved reliability of connections

* Potential commercial applications of this technology:
  * Semiconductor industry advancements
  * Consumer electronics manufacturing
  * Telecommunications equipment development

* Possible prior art:
  * Similar mounting techniques in semiconductor devices
  * Existing methods for connecting electrodes in electronic components

Questions:

1. How does the protrusion on the base member contribute to the mounting of the semiconductor chip?
   - The protrusion on the base member provides a point of overlap for the space on the semiconductor chip, ensuring secure mounting and alignment.

2. What are the specific advantages of having a space between the electrodes and the control pad on the semiconductor chip?
   - The space allows for better insulation and prevents interference between the electrodes and the control pad, improving the overall performance and reliability of the semiconductor device.


==Original Abstract Submitted==

A semiconductor device includes a base member and a semiconductor chip. The base member includes a first surface, a second surface opposite to the first surface, and a protrusion at the second surface side. The semiconductor chip being mounted on the second surface of the base member. The semiconductor chip includes first and second electrodes, a control pad, and a semiconductor part. The first electrode is provided on a back surface of the semiconductor part. The second electrode and the control pad are provided on a front surface of the semiconductor part. The semiconductor chip includes a space between the second electrode and the control pad at the front surface side of the semiconductor part. The semiconductor chip is mounted so that the space between the second electrode and the control pad overlaps the protrusion of the base member.



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