View source for 18178973. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)

=SEMICONDUCTOR DEVICE=


==Organization Name==

[[:Category:KABUSHIKI KAISHA TOSHIBA|KABUSHIKI KAISHA TOSHIBA]]


[[Category:KABUSHIKI KAISHA TOSHIBA]]

==Inventor(s)==

[[:Category:Masatoshi Arai of Hakusan Ishikawa (JP)|Masatoshi Arai of Hakusan Ishikawa (JP)]][[Category:Masatoshi Arai of Hakusan Ishikawa (JP)]]

[[:Category:Kazuki Matsuo of Nonoichi Ishikawa (JP)|Kazuki Matsuo of Nonoichi Ishikawa (JP)]][[Category:Kazuki Matsuo of Nonoichi Ishikawa (JP)]]

[[:Category:Masaru Izumisawa of Kanazawa Ishikawa (JP)|Masaru Izumisawa of Kanazawa Ishikawa (JP)]][[Category:Masaru Izumisawa of Kanazawa Ishikawa (JP)]]

==SEMICONDUCTOR DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18178973 titled 'SEMICONDUCTOR DEVICE

==Simplified Explanation==

The semiconductor device described in the abstract includes a base member with a protrusion, a semiconductor chip mounted on the base member, and a conductive member bonded to the semiconductor chip via a connection member. The connection member extends along a space between the second electrode and the control pad, with the protrusion of the base member overlapping the connection member.

* Base member with protrusion:
    - The base member of the semiconductor device has a protrusion at the second surface, providing additional support and stability for the semiconductor chip.

* Semiconductor chip with electrodes and control pad:
    - The semiconductor chip includes first and second electrodes, a control pad, and a semiconductor part with front and back surfaces, allowing for efficient electrical connections and control of the device.

* Conductive member with connection member:
    - The conductive member is bonded to the second electrode of the semiconductor chip via a connection member, ensuring reliable electrical connections within the device.

* Potential Applications:
    - This technology could be applied in various electronic devices such as smartphones, tablets, and computers to improve the performance and reliability of semiconductor components.

* Problems Solved:
    - This technology solves the problem of ensuring stable electrical connections and support for semiconductor chips in electronic devices, reducing the risk of malfunctions or failures.

* Benefits:
    - The benefits of this technology include improved durability, efficiency, and performance of semiconductor devices, leading to enhanced overall functionality and user experience.

* Potential Commercial Applications:
    - The potential commercial applications of this technology could include the semiconductor industry, consumer electronics manufacturers, and other companies producing electronic devices.

* Possible Prior Art:
    - One possible prior art could be the use of similar connection methods in semiconductor devices, but with variations in the design and implementation compared to the described technology.

### Unanswered Questions:

#### How does the protrusion of the base member enhance the stability of the semiconductor chip?
The protrusion of the base member provides additional support and structural integrity to the semiconductor chip, reducing the risk of damage or disconnection due to external forces or vibrations.

#### What materials are commonly used for the conductive member and connection member in semiconductor devices?
The conductive member and connection member in semiconductor devices are typically made of materials such as copper, gold, or other conductive metals to ensure efficient electrical conductivity and reliability in the device.


==Original Abstract Submitted==

A semiconductor device includes a base member, a semiconductor chip, and a conductive member. The base member includes a first surface, a second surface opposite to the first surface, and a protrusion at the second surface side. The semiconductor chip is mounted on the second surface of the base member. The semiconductor chip includes first and second electrodes, a control pad, and a semiconductor part. The semiconductor part has front and back surfaces; the first electrode is provided on the back surface; and the second electrode and the control pad are provided on the front surface. The conductive member bonded on the second electrode via a connection member. The connection member includes a side surface extending along a space between the second electrode and the control pad. The protrusion of the base member overlaps the second connection member and extends along the side surface of the connection member.



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