View source for 18165920. METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURING REDISTRIBUTION CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

=METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURING REDISTRIBUTION CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Co., Ltd.|Taiwan Semiconductor Manufacturing Co., Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Co., Ltd.]]

==Inventor(s)==

[[:Category:Chung-Liang Chang of Hsinchu City (TW)|Chung-Liang Chang of Hsinchu City (TW)]][[Category:Chung-Liang Chang of Hsinchu City (TW)]]

[[:Category:Ming-Che Ho of Tainan City (TW)|Ming-Che Ho of Tainan City (TW)]][[Category:Ming-Che Ho of Tainan City (TW)]]

[[:Category:Hung-Jui Kuo of Hsinchu City (TW)|Hung-Jui Kuo of Hsinchu City (TW)]][[Category:Hung-Jui Kuo of Hsinchu City (TW)]]

==METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURING REDISTRIBUTION CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18165920 titled 'METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURING REDISTRIBUTION CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

The abstract describes a method for forming a conductive material on a seed layer using an electrolytic plating process with a specific electrolytic composition.

* Seed layer is formed as the base.
* Conductive material is formed through an electrolytic plating process.
* Electrolytic composition includes copper ions, accelerator agent, and suppressor agent.
* The structure of the electrolytic composition is crucial for the plating process.

Potential Applications:
* Electronics manufacturing
* Printed circuit board production
* Semiconductor industry

Problems Solved:
* Efficient and precise formation of conductive materials
* Enhanced conductivity and durability of plated materials

Benefits:
* Improved quality of electronic components
* Cost-effective manufacturing process
* Increased productivity in the production of circuit boards

Commercial Applications:
* Suppliers of electronic components
* PCB manufacturing companies
* Semiconductor equipment manufacturers

Prior Art:
* Researchers can explore prior patents related to electrolytic plating processes and conductive material formation.

Frequently Updated Research:
* Stay updated on advancements in electrolytic plating techniques and materials for electronic applications.

Questions about the technology:
1. How does the specific electrolytic composition impact the quality of the conductive material formed?
2. What are the potential drawbacks of using electrolytic plating for conductive material formation?


==Original Abstract Submitted==

A method including the following steps is provided. A seed layer is formed. Conductive material is formed on the seed layer by performing an electrolytic plating process with an electrolytic composition comprising: a source of copper ions; an accelerator agent; and a suppressor agent, by structure represented (1) or (2):



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[[Category:C25D3/38]]
[[Category:C25D7/12]]
[[Category:H01L21/56]]
[[Category:CPC_H01L21/486]]