View source for 18148355. INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES simplified abstract (Intel Corporation)

=INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH  GLASS CORE LAYER HAVING ROUGHENED SURFACES=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Jeremy D. Ecton of Gilbert AZ (US)|Jeremy D. Ecton of Gilbert AZ (US)]][[Category:Jeremy D. Ecton of Gilbert AZ (US)]]

[[:Category:Srinivas V. Pietambaram of Chandler AZ (US)|Srinivas V. Pietambaram of Chandler AZ (US)]][[Category:Srinivas V. Pietambaram of Chandler AZ (US)]]

[[:Category:Gang Duan of Chandler AZ (US)|Gang Duan of Chandler AZ (US)]][[Category:Gang Duan of Chandler AZ (US)]]

[[:Category:Brandon Christian Marin of Gilbert AZ (US)|Brandon Christian Marin of Gilbert AZ (US)]][[Category:Brandon Christian Marin of Gilbert AZ (US)]]

[[:Category:Suddhasattwa Nad of Chandler AZ (US)|Suddhasattwa Nad of Chandler AZ (US)]][[Category:Suddhasattwa Nad of Chandler AZ (US)]]

[[:Category:Oladeji T. Fadayomi of Maricopa AZ (US)|Oladeji T. Fadayomi of Maricopa AZ (US)]][[Category:Oladeji T. Fadayomi of Maricopa AZ (US)]]

[[:Category:Manuel Gadogbe of Queen Creek AZ (US)|Manuel Gadogbe of Queen Creek AZ (US)]][[Category:Manuel Gadogbe of Queen Creek AZ (US)]]

[[:Category:Matthew L. Tingey of Mesa AZ (US)|Matthew L. Tingey of Mesa AZ (US)]][[Category:Matthew L. Tingey of Mesa AZ (US)]]

==INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH  GLASS CORE LAYER HAVING ROUGHENED SURFACES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18148355 titled 'INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH  GLASS CORE LAYER HAVING ROUGHENED SURFACES

The integrated circuit package substrate described in the patent application includes a glass layer with at least one roughened surface and a metal component in contact with the roughened surface.

* Glass layer with roughened surface
* Metal component in contact with roughened surface
* Roughness of the surface above 100 nm
* Potential for improved adhesion and electrical performance
* Innovation in packaging technology

Potential Applications:
- Semiconductor packaging
- Electronics manufacturing

Problems Solved:
- Enhanced adhesion between glass and metal components
- Improved electrical performance in integrated circuits

Benefits:
- Increased reliability of integrated circuit packages
- Better signal transmission in electronic devices

Commercial Applications:
Title: Advanced Semiconductor Packaging Technology
Description: This technology can be used in the production of high-performance electronic devices, improving their reliability and functionality. It has the potential to impact the semiconductor industry by enhancing the quality of integrated circuit packages.

Questions about the technology:
1. How does the roughened surface of the glass layer improve the performance of the integrated circuit package?
2. What are the specific advantages of using a metal component in contact with the roughened surface of the glass layer?


==Original Abstract Submitted==

In one embodiment, an integrated circuit package substrate includes a glass layer having at least one roughened surface (e.g., with an average roughness above 100 nm) and a metal (e.g., a metal trace or metal via) in contact with the roughened surface of the glass layer.



[[Category:H01L23/498]]
[[Category:H01L21/48]]
[[Category:H01L23/15]]
[[Category:CPC_H01L23/49827]]