View source for 18148332. DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHODS OF PREPARING SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)

=DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHODS OF PREPARING SAME=


==Organization Name==

[[:Category:ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.|ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.]]


[[Category:ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.]]

==Inventor(s)==

[[:Category:Cyprian Emeka Uzoh of San Jose CA (US)|Cyprian Emeka Uzoh of San Jose CA (US)]][[Category:Cyprian Emeka Uzoh of San Jose CA (US)]]

==DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHODS OF PREPARING SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18148332 titled 'DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHODS OF PREPARING SAME

The abstract of the patent application describes a bonded structure involving elements with nonconductive field regions and conductive features, formed without the use of adhesive.

* The bonded structure includes a first element with a nonconductive field region and a conductive feature, where the surfaces of these components define a bonding surface.
* The first conductive feature consists of aluminum and has a continuous sidewall, with a second portion containing a different metal composition or fluorine at the surface.
* A second element in the bonded structure also has nonconductive and conductive regions directly bonded to the corresponding regions of the first element without adhesive.

Potential Applications:
- Electronics manufacturing
- Semiconductor industry
- Aerospace technology

Problems Solved:
- Eliminates the need for adhesive in bonding structures
- Enhances the conductivity and reliability of bonded elements

Benefits:
- Improved structural integrity
- Enhanced electrical performance
- Simplified manufacturing processes

Commercial Applications:
Title: Advanced Bonded Structures for High-Tech Industries
This technology can be utilized in the production of electronic devices, semiconductors, and aerospace components, offering improved performance and reliability in critical applications.

Prior Art:
Readers can explore prior research in the fields of materials science, semiconductor bonding, and adhesive-free assembly techniques to gain a deeper understanding of the innovation presented in this patent application.

Frequently Updated Research:
Stay informed about the latest developments in materials engineering, semiconductor manufacturing, and adhesive technologies to track advancements related to this innovative bonded structure.

Questions about the Technology:
1. How does the absence of adhesive impact the reliability of the bonded structure?
2. What are the potential challenges in scaling up the production of these bonded structures?


==Original Abstract Submitted==

An element, a bonded structure including the element, and a method of forming the same are disclosed. The bonded structure can include a first element having a first nonconductive field region and a first conductive feature. A surface of the first nonconductive field region and a surface of the first conductive feature at least partially defining a bonding surface of the first element. The first conductive feature includes a first portion and a second portion over the first portion and at least partially defines the surface of the first conductive feature. The first portion includes aluminum. The first conductive feature has a continuous sidewall along the first portion and the second portion. The second portion includes different metal composition from the first portion or comprising fluorine at the surface of the first conductive feature. The bonded structure can include a second element having a second nonconductive field region and a second conductive feature. A surface of the second nonconductive field region is directly bonded to the first nonconductive field region without an intervening adhesive along a bond interface and a surface of the second conductive feature is directly bonded to the second conductive feature without an intervening adhesive along the bond interface.



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