View source for 18146886. SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL SUBSTRATE INTEGRATED WAVEGUIDE TRANSITION AND HORIZONTAL GROUNDED COPLANAR WAVEGUIDE TRANSITION simplified abstract (Texas Instruments Incorporated)

=SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL SUBSTRATE INTEGRATED WAVEGUIDE TRANSITION AND HORIZONTAL GROUNDED COPLANAR WAVEGUIDE TRANSITION=


==Organization Name==

[[:Category:Texas Instruments Incorporated|Texas Instruments Incorporated]]


[[Category:Texas Instruments Incorporated]]

==Inventor(s)==

[[:Category:Aditya Nitin Jogalekar of Dallas TX (US)|Aditya Nitin Jogalekar of Dallas TX (US)]][[Category:Aditya Nitin Jogalekar of Dallas TX (US)]]

[[:Category:Harshpreet Singh Phull Bakshi of Dallas TX (US)|Harshpreet Singh Phull Bakshi of Dallas TX (US)]][[Category:Harshpreet Singh Phull Bakshi of Dallas TX (US)]]

[[:Category:Rajen Manicon Murugan of Dallas TX (US)|Rajen Manicon Murugan of Dallas TX (US)]][[Category:Rajen Manicon Murugan of Dallas TX (US)]]

[[:Category:Sylvester Ankamah-kusi of Dallas TX (US)|Sylvester Ankamah-kusi of Dallas TX (US)]][[Category:Sylvester Ankamah-kusi of Dallas TX (US)]]

==SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL SUBSTRATE INTEGRATED WAVEGUIDE TRANSITION AND HORIZONTAL GROUNDED COPLANAR WAVEGUIDE TRANSITION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18146886 titled 'SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL SUBSTRATE INTEGRATED WAVEGUIDE TRANSITION AND HORIZONTAL GROUNDED COPLANAR WAVEGUIDE TRANSITION

The patent application describes an electronic device with a multilevel package substrate that integrates horizontal and vertical substrate integrated waveguides (SIWs) with transitions to grounded coplanar waveguides (GCPWs), a semiconductor die with conductive structures connected to the GCPW, and a package structure enclosing the semiconductor die and part of the substrate.

* Horizontal and vertical SIWs integrated into a multilevel package substrate
* Transitions between SIWs and GCPWs for signal transmission
* Semiconductor die with conductive structures connected to GCPW
* Package structure enclosing semiconductor die and substrate
* Enhanced signal transmission and packaging efficiency

Potential Applications:
- Telecommunications
- Radar systems
- Satellite communication
- Wireless networks

Problems Solved:
- Improved signal transmission efficiency
- Enhanced packaging density
- Better integration of components

Benefits:
- Higher performance in signal transmission
- Compact and efficient packaging
- Improved overall device reliability

Commercial Applications:
Title: Advanced Signal Transmission and Packaging Technology for Telecommunications
This technology can be used in the development of high-performance communication devices for various industries, including telecommunications, aerospace, and defense.

Prior Art:
Researchers can explore prior patents related to substrate integrated waveguides, coplanar waveguides, and semiconductor packaging technologies to understand the evolution of this innovation.

Frequently Updated Research:
Researchers are continually exploring ways to enhance signal transmission efficiency and packaging density in electronic devices. Stay updated on the latest advancements in substrate integrated waveguides and semiconductor packaging technologies for potential improvements in this field.

Questions about the Technology:
1. How does the integration of horizontal and vertical SIWs improve signal transmission efficiency?
2. What are the key advantages of using GCPWs in conjunction with SIWs for electronic devices?


==Original Abstract Submitted==

An electronic device includes a multilevel package substrate with a horizontal substrate integrated waveguide (SIW) with a channel, a vertical SIW with an opening, a grounded coplanar waveguide (GCPW), a first transition between the horizontal SIW and the GCPW, and a second transition between the horizontal and vertical SIWs, as well as a semiconductor die having conductive structures coupled to a signal trace and a ground trace of the GCPW, and a package structure that encloses the semiconductor die and a portion of the multilevel package substrate.



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