View source for 18137595. POWER MODULE FOR VEHICLE simplified abstract (HYUNDAI MOTOR COMPANY)

=POWER MODULE FOR VEHICLE=


==Organization Name==

[[:Category:HYUNDAI MOTOR COMPANY|HYUNDAI MOTOR COMPANY]]


[[Category:HYUNDAI MOTOR COMPANY]]

==Inventor(s)==

[[:Category:Jun Hee Park of Hwaseong-Si (KR)|Jun Hee Park of Hwaseong-Si (KR)]][[Category:Jun Hee Park of Hwaseong-Si (KR)]]

[[:Category:Sung Taek Hwang of Seoul (KR)|Sung Taek Hwang of Seoul (KR)]][[Category:Sung Taek Hwang of Seoul (KR)]]

[[:Category:Nam Sik Kong of Hwaseong-Si (KR)|Nam Sik Kong of Hwaseong-Si (KR)]][[Category:Nam Sik Kong of Hwaseong-Si (KR)]]

[[:Category:Myung III You of Gwangju (KR)|Myung III You of Gwangju (KR)]][[Category:Myung III You of Gwangju (KR)]]

==POWER MODULE FOR VEHICLE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18137595 titled 'POWER MODULE FOR VEHICLE

==Simplified Explanation==

The patent application describes a power module for a vehicle that includes two substrates with metal circuits, spacers, and a semiconductor chip with power and signal pads.

* First substrate with a metal circuit on one surface and a spacer extending in one direction
* Second substrate facing the first substrate with a metal circuit on a surface facing the first substrate and a spacer extending in the opposite direction
* Semiconductor chip placed between the substrates with power and signal pads
* Spacers from both substrates extend towards each other, with the second spacer connected to the power and signal pads

== Potential Applications ==
The technology described in this patent application could be applied in electric vehicles, hybrid vehicles, and other automotive systems requiring power modules for efficient energy management.

== Problems Solved ==
This technology solves the problem of efficiently managing power distribution in vehicles, ensuring optimal performance and reliability of the power module.

== Benefits ==
The benefits of this technology include improved power efficiency, compact design, and enhanced thermal management in vehicle power systems.

== Potential Commercial Applications ==
The technology could be commercially applied in electric vehicle manufacturing, automotive component production, and other industries requiring advanced power module solutions.

== Possible Prior Art ==
One possible prior art for this technology could be existing power module designs for vehicles, although the specific configuration and features described in this patent application may offer unique advantages.

== Unanswered Questions ==

=== How does this technology compare to traditional power module designs in terms of efficiency and performance? ===

The article does not provide a direct comparison between this technology and traditional power module designs, leaving the reader to speculate on the potential advantages or disadvantages.

=== Are there any specific vehicle models or manufacturers interested in implementing this technology? ===

The article does not mention any specific partnerships or collaborations with vehicle manufacturers, leaving the reader curious about the potential market adoption of this technology.


==Original Abstract Submitted==

A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate and including a power pad and a signal pad, the first spacer and the second spacer extending toward each other, and the second spacer including a 2-1st spacer connected to the power pad and a 2-2nd spacer connected to the signal pad.



[[Category:H01L23/498]]
[[Category:H01L21/48]]