View source for 18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

=CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME=


==Organization Name==

[[:Category:SAMSUNG ELECTRO-MECHANICS CO., LTD.|SAMSUNG ELECTRO-MECHANICS CO., LTD.]]


[[Category:SAMSUNG ELECTRO-MECHANICS CO., LTD.]]

==Inventor(s)==

[[:Category:Sang-min Lee of Suwon-si (KR)|Sang-min Lee of Suwon-si (KR)]][[Category:Sang-min Lee of Suwon-si (KR)]]

==CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18127235 titled 'CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME

The circuit board described in the abstract includes a first insulating layer without a reinforcing material, a conductive pad protruding above the layer, a dam protruding from the layer's surface outside the pad's region, and a second insulating layer below the first with a reinforcing material.

* The first insulating layer lacks a reinforcing material.
* A conductive pad protrudes above the surface of the first insulating layer.
* A dam protrudes from the layer's surface outside the region of the conductive pad.
* The second insulating layer beneath the first includes a reinforcing material.
* The height of the dam is higher than the height of the conductive pad.

Potential Applications:
- Electronics manufacturing
- Printed circuit board (PCB) production
- Semiconductor industry

Problems Solved:
- Enhanced structural integrity of circuit boards
- Improved reliability of electronic devices
- Increased durability of PCBs

Benefits:
- Stronger circuit board construction
- Reduced risk of damage or failure
- Long-lasting performance

Commercial Applications:
Title: "Innovative Circuit Board Design for Enhanced Durability"
This technology can be utilized in various industries such as consumer electronics, automotive, aerospace, and telecommunications for more reliable and durable electronic devices.

Questions about the technology:
1. How does the absence of a reinforcing material in the first insulating layer impact the overall strength of the circuit board?
2. What specific advantages does the protruding dam feature offer in terms of circuit board performance and longevity?


==Original Abstract Submitted==

A circuit board according to an embodiment includes: a first insulating layer that does not include a reinforcing material; a conductive pad that protrudes above a surface of the first insulating layer; a dam that protrudes from the surface of the first insulating layer and is disposed outside a region where the conductive pad is disposed on a plane; and a second insulating layer that is disposed below the first insulating layer and includes a reinforcing material. A height of the dam based on the surface of the first insulating layer is higher than a height of the conductive pad.



[[Category:H01L23/00]]
[[Category:H01L21/48]]
[[Category:H01L23/498]]
[[Category:CPC_H01L24/26]]