View source for 18126933. WAFER HEATING APPARATUS AND WAFER PROCESSING APPARATUS USING THE SAME simplified abstract (SEMES CO., LTD.)

=WAFER HEATING APPARATUS AND WAFER PROCESSING APPARATUS USING THE SAME=


==Organization Name==

[[:Category:SEMES CO., LTD.|SEMES CO., LTD.]]


[[Category:SEMES CO., LTD.]]

==Inventor(s)==

[[:Category:Soo Han Song of Goyang-si (KR)|Soo Han Song of Goyang-si (KR)]][[Category:Soo Han Song of Goyang-si (KR)]]

[[:Category:Jung Bong Choi of Suwon-si (KR)|Jung Bong Choi of Suwon-si (KR)]][[Category:Jung Bong Choi of Suwon-si (KR)]]

[[:Category:Kang Seop Yun of Cheonan-si (KR)|Kang Seop Yun of Cheonan-si (KR)]][[Category:Kang Seop Yun of Cheonan-si (KR)]]

[[:Category:Young Il Lee of Cheonan-si (KR)|Young Il Lee of Cheonan-si (KR)]][[Category:Young Il Lee of Cheonan-si (KR)]]

[[:Category:Min Ok Kang of Daejeon (KR)|Min Ok Kang of Daejeon (KR)]][[Category:Min Ok Kang of Daejeon (KR)]]

==WAFER HEATING APPARATUS AND WAFER PROCESSING APPARATUS USING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18126933 titled 'WAFER HEATING APPARATUS AND WAFER PROCESSING APPARATUS USING THE SAME

==Simplified Explanation==

The patent application describes a wafer heating apparatus with an improved structure for efficient cooling of a terminal block, along with a wafer processing apparatus utilizing the same technology.

* The wafer heating apparatus includes a heater below the wafer, a cooling plate below the heater providing cool air, and a terminal block supplying power to the heater with a lower end portion in contact with the cooling plate.

== Potential Applications ==
The technology can be applied in semiconductor manufacturing processes, specifically in wafer heating and processing stages.

== Problems Solved ==
1. Efficient cooling of the terminal block in a wafer heating apparatus.
2. Ensuring uniform heating of the wafer during processing.

== Benefits ==
1. Improved efficiency in wafer heating and processing.
2. Enhanced control over temperature regulation.
3. Increased reliability and longevity of the heating apparatus.

== Potential Commercial Applications ==
"Enhanced Wafer Heating Technology for Semiconductor Manufacturing"

== Possible Prior Art ==
Prior art may include traditional wafer heating apparatus designs with less efficient cooling mechanisms.

== Unanswered Questions ==
1. What specific semiconductor manufacturing processes can benefit the most from this technology?
2. Are there any limitations to the size or type of wafers that can be effectively heated using this apparatus?


==Original Abstract Submitted==

Proposed are a wafer heating apparatus and a wafer processing apparatus using the same. More particularly, proposed are a wafer heating apparatus having an improved structure to enable efficient cooling of a terminal block, and a wafer processing apparatus using the same. A wafer heating apparatus for heating a wafer according to one embodiment includes a heater disposed below the wafer and configured to serve as a heat source, a cooling plate disposed below the heater and configured to provide cool air, and a terminal block configured to supply power to the heater and having a lower end portion in contact with the cooling plate.



[[Category:H01L21/67]]