View source for 18120981. DRYING APPARATUS AND SUBSTRATE TREATING APPARATUS simplified abstract (SEMES CO., LTD.)

=DRYING APPARATUS AND SUBSTRATE TREATING APPARATUS=


==Organization Name==

[[:Category:SEMES CO., LTD.|SEMES CO., LTD.]]


[[Category:SEMES CO., LTD.]]

==Inventor(s)==

[[:Category:HAE-WON Choi of Daejeon (KR)|HAE-WON Choi of Daejeon (KR)]][[Category:HAE-WON Choi of Daejeon (KR)]]

[[:Category:JAE SEONG Lee of Hwaseong-si (KR)|JAE SEONG Lee of Hwaseong-si (KR)]][[Category:JAE SEONG Lee of Hwaseong-si (KR)]]

[[:Category:HONG CHAN Cho of Goyang-si (KR)|HONG CHAN Cho of Goyang-si (KR)]][[Category:HONG CHAN Cho of Goyang-si (KR)]]

==DRYING APPARATUS AND SUBSTRATE TREATING APPARATUS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18120981 titled 'DRYING APPARATUS AND SUBSTRATE TREATING APPARATUS

==Simplified Explanation==

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a first chamber having a supply port for supplying a treating fluid; a second chamber in combination with the first chamber defining a treating space; a support member configured to support a substrate in the treating space; and a baffle unit installed in the first chamber to face the support port, and wherein the baffle unit includes: a first baffle assembly including a first baffle having first holes through which the treating fluid flow; and a second baffle assembly installed at a position farther from the support port than the first baffle assembly, and including a second baffle having second holes through which the treating fluid flow.

* The substrate treating apparatus includes a first chamber with a supply port for treating fluid, a second chamber defining a treating space, a support member for holding the substrate, and a baffle unit with two baffle assemblies to control the flow of treating fluid.
* The first baffle assembly has holes for fluid flow, while the second baffle assembly, located farther from the support port, also has holes for fluid flow.

== Potential Applications ==
The technology could be applied in industries such as semiconductor manufacturing, where precise substrate treatment is crucial for high-quality production.

== Problems Solved ==
This technology helps in controlling the flow of treating fluid during substrate treatment, ensuring uniform and efficient processing.

== Benefits ==
The substrate treating apparatus offers improved accuracy and consistency in treating substrates, leading to higher quality end products.

== Potential Commercial Applications ==
"Enhancing Substrate Treatment Efficiency with Baffle Unit Technology"

== Possible Prior Art ==
There may be prior art related to baffle units used in substrate treatment processes, but specific examples are not provided in this abstract.

== Unanswered Questions ==

=== How does the baffle unit impact the overall efficiency of the substrate treatment process? ===
The article does not delve into the specific effects of the baffle unit on the efficiency of the substrate treatment process. Further research or experimentation may be needed to determine the extent of this impact.

=== Are there any limitations to the size or type of substrates that can be treated using this apparatus? ===
The abstract does not mention any restrictions on the size or type of substrates that can be treated with this apparatus. Understanding any potential limitations could be crucial for industries considering implementing this technology.


==Original Abstract Submitted==

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a first chamber having a supply port for supplying a treating fluid; a second chamber in combination with the first chamber defining a treating space; a support member configured to support a substrate in the treating space; and a baffle unit installed in the first chamber to face the support port, and wherein the baffle unit includes: a first baffle assembly including a first baffle having first holes through which the treating fluid flow; and a second baffle assembly installed at a position farther from the support port than the first baffle assembly, and including a second baffle having second holes through which the treating fluid flow.



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