View source for 18119270. PACKAGE STRUCTURE simplified abstract (Advanced Semiconductor Engineering, Inc.)

=PACKAGE STRUCTURE=


==Organization Name==

[[:Category:Advanced Semiconductor Engineering, Inc.|Advanced Semiconductor Engineering, Inc.]]


[[Category:Advanced Semiconductor Engineering, Inc.]]

==Inventor(s)==

[[:Category:Hai-Ming Chen of Kaohsiung (TW)|Hai-Ming Chen of Kaohsiung (TW)]][[Category:Hai-Ming Chen of Kaohsiung (TW)]]

[[:Category:Hung-Yi Lin of Kaohsiung (TW)|Hung-Yi Lin of Kaohsiung (TW)]][[Category:Hung-Yi Lin of Kaohsiung (TW)]]

[[:Category:Cheng-Yuan Kung of Kaohsiung (TW)|Cheng-Yuan Kung of Kaohsiung (TW)]][[Category:Cheng-Yuan Kung of Kaohsiung (TW)]]

==PACKAGE STRUCTURE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18119270 titled 'PACKAGE STRUCTURE

The abstract of the patent application describes a package structure that includes a semiconductor substrate with a high-speed signal transmission region and a power transmission region.

* The semiconductor substrate has a lower portion and an upper portion.
* The upper portion defines a high-speed signal transmission region with a first region for communication with a first electronic component and a second region for communication with an external device.
* The lower portion defines a power transmission region.

Potential Applications:
- This technology could be used in electronic devices that require high-speed signal transmission and power transmission capabilities.
- It could be applied in telecommunications equipment, data centers, and other high-performance electronic systems.

Problems Solved:
- The package structure addresses the need for efficient signal transmission and power distribution within electronic devices.
- It provides a compact and integrated solution for managing high-speed signals and power requirements.

Benefits:
- Improved signal integrity and reduced power losses in electronic systems.
- Enhanced reliability and performance of high-speed communication devices.

Commercial Applications:
- The technology could be valuable in the development of high-speed data transmission equipment, networking devices, and advanced computing systems.
- It may have significant market implications in industries that rely on fast and reliable electronic communication.

Questions about the Technology:
1. How does the package structure optimize signal transmission and power distribution in electronic devices?
2. What are the key advantages of using this semiconductor substrate in high-speed communication systems?

Frequently Updated Research:
- Stay updated on advancements in semiconductor packaging technologies and their impact on high-speed signal transmission and power management in electronic devices.


==Original Abstract Submitted==

A package structure is provided. The package structure includes a semiconductor substrate. The semiconductor substrate includes a lower portion and an upper portion. The upper portion of the semiconductor substrate defines a high speed signal transmission region. The high speed signal transmission region includes a first region configured to communicate with a first electronic component and a second region configured to communicate with an external device. The lower portion of the semiconductor substrate defines a power transmission region



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