View source for 18100281. INDUCTOR CONNECTIVITY AND ASSEMBLIES simplified abstract (Infineon Technologies Austria AG)

=INDUCTOR CONNECTIVITY AND ASSEMBLIES=


==Organization Name==

[[:Category:Infineon Technologies Austria AG|Infineon Technologies Austria AG]]


[[Category:Infineon Technologies Austria AG]]

==Inventor(s)==

[[:Category:Kushal Kshirsagar of Fremont CA (US)|Kushal Kshirsagar of Fremont CA (US)]][[Category:Kushal Kshirsagar of Fremont CA (US)]]

[[:Category:Eung San Cho of Torrance CA (US)|Eung San Cho of Torrance CA (US)]][[Category:Eung San Cho of Torrance CA (US)]]

[[:Category:Luca Peluso of Villach (AT)|Luca Peluso of Villach (AT)]][[Category:Luca Peluso of Villach (AT)]]

[[:Category:Danny Clavette of Greene RI (US)|Danny Clavette of Greene RI (US)]][[Category:Danny Clavette of Greene RI (US)]]

[[:Category:Angela Kessler of Sinzing (DE)|Angela Kessler of Sinzing (DE)]][[Category:Angela Kessler of Sinzing (DE)]]

==INDUCTOR CONNECTIVITY AND ASSEMBLIES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18100281 titled 'INDUCTOR CONNECTIVITY AND ASSEMBLIES

The abstract of this patent application describes an apparatus and method involving a heat sink element made of electrically conductive material. Two additional elements of electrically conductive material are fixedly connected to the heat sink element, extending substantially orthogonal from its surface.

* The apparatus includes a heat sink element fabricated from electrically conductive material.
* A first element of electrically conductive material is fixedly connected to the heat sink element.
* A second element of electrically conductive material is also fixedly connected to the heat sink element.
* The first and second elements extend substantially orthogonal from the surface of the heat sink element.

Potential Applications:
- Electronic devices requiring efficient heat dissipation.
- Power electronics applications.
- LED lighting systems.

Problems Solved:
- Improved heat dissipation in electronic devices.
- Enhanced thermal management in power electronics.
- Increased lifespan of components due to better cooling.

Benefits:
- Enhanced performance of electronic devices.
- Increased reliability of power electronics.
- Cost-effective thermal management solution.

Commercial Applications:
Title: "Advanced Thermal Management Solutions for Electronic Devices"
This technology can be used in various industries such as consumer electronics, automotive, and telecommunications for improved thermal management and performance optimization.

Questions about the technology:
1. How does this innovation compare to traditional heat sink designs?
- The innovative design of this heat sink element allows for more efficient heat dissipation compared to traditional designs.
2. What are the potential cost savings associated with implementing this technology?
- By improving thermal management, this technology can lead to cost savings by increasing the lifespan of electronic components and reducing the need for frequent replacements.


==Original Abstract Submitted==

An apparatus and method as discussed herein includes a heat sink element fabricated from electrically conductive material. A first element of electrically conductive material may be fixedly connected to the heat sink element. A second element of electrically conductive material may be fixedly connected to the heat sink element. The first element and the second element may extend substantially orthogonal from a surface of the heat sink element.



[[Category:H01F27/22]]
[[Category:H01F41/02]]
[[Category:CPC_H01F27/22]]