View source for 18099715. METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

=METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]

==Inventor(s)==

[[:Category:Shih-Wei Chen of Hsinchu (TW)|Shih-Wei Chen of Hsinchu (TW)]][[Category:Shih-Wei Chen of Hsinchu (TW)]]

[[:Category:Po-Yuan Teng of Hsinchu (TW)|Po-Yuan Teng of Hsinchu (TW)]][[Category:Po-Yuan Teng of Hsinchu (TW)]]

[[:Category:Chiahung Liu of Hsinchu (TW)|Chiahung Liu of Hsinchu (TW)]][[Category:Chiahung Liu of Hsinchu (TW)]]

[[:Category:HAO-YI Tsai of Hsinchu (TW)|HAO-YI Tsai of Hsinchu (TW)]][[Category:HAO-YI Tsai of Hsinchu (TW)]]

==METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18099715 titled 'METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK

==Simplified Explanation==

The present disclosure relates to a method for forming a mark, a packaging method for a semiconductor device, and a semiconductor device having the mark, wherein the marking material is a polymer compound and the light transmittance of the marking material is less than 50%, which is suitable for forming the mark on the semiconductor device by laser sintering, and the marking material is sintered to make the resin cross-link and cure to form a cured product. In addition, in one embodiment, the cured product formed by the marking material can be used as a deflector to guide the flow of the underfill and control the flow rate of underfill, so as to effectively solve the problem of uneven flow rate of the underfill.

* The marking material used is a polymer compound with low light transmittance, making it suitable for laser sintering on semiconductor devices.
* The cured product formed by the marking material can act as a deflector to guide and control the flow rate of underfill, addressing the issue of uneven flow rate.

== Potential Applications ==
The technology can be applied in semiconductor packaging processes to create marks on devices and control the flow of underfill.

== Problems Solved ==
1. Uneven flow rate of underfill in semiconductor devices.
2. Difficulty in forming marks on semiconductor devices using laser sintering.

== Benefits ==
1. Improved control over underfill flow rate.
2. Enhanced marking capabilities on semiconductor devices.

== Potential Commercial Applications ==
"Polymer Compound Marking Method for Semiconductor Devices: Applications and Benefits"

== Possible Prior Art ==
There may be prior art related to laser sintering of marking materials on semiconductor devices, but specific information is not provided in this disclosure.

=== Unanswered Questions ===

== How does the light transmittance of the marking material affect the laser sintering process?
The abstract mentions that the light transmittance of the marking material is less than 50%, but it does not explain how this characteristic impacts the laser sintering process.

== What specific types of polymer compounds are suitable for forming the mark on semiconductor devices?
The abstract mentions that the marking material is a polymer compound, but it does not specify which types of polymer compounds are most effective for this application.


==Original Abstract Submitted==

The present disclosure relates to a method for forming a mark, a packaging method for a semiconductor device, and a semiconductor device having the mark, wherein the marking material is a polymer compound and the light transmittance of the marking material is less than 50%, which is suitable for forming the mark on the semiconductor device by laser sintering, and the marking material is sintered to make the resin cross-link and cure to form a cured product. In addition, in one embodiment, the cured product formed by the marking material can be used as a deflector to guide the flow of the underfill and control the flow rate of underfill, so as to effectively solve the problem of uneven flow rate of the underfill.



[[Category:H01L23/544]]
[[Category:H01L21/56]]
[[Category:H01L23/31]]
[[Category:H10B80/00]]