View source for 18098803. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)

=SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME=


==Organization Name==

[[:Category:NANYA TECHNOLOGY CORPORATION|NANYA TECHNOLOGY CORPORATION]]


[[Category:NANYA TECHNOLOGY CORPORATION]]

==Inventor(s)==

[[:Category:WU-DER Yang of TAOYUAN CITY (TW)|WU-DER Yang of TAOYUAN CITY (TW)]][[Category:WU-DER Yang of TAOYUAN CITY (TW)]]

==SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18098803 titled 'SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

The present disclosure introduces a semiconductor package structure and a method for manufacturing it. The structure includes a first substrate with a recess on one side, a first semiconductor die in the recess, a second semiconductor die on the opposite side, and a second substrate bonded to the first side of the first substrate.

* First substrate with recess for first semiconductor die
* Second semiconductor die bonded to the second side of the first substrate
* Second substrate electrically bonded to the first side of the first substrate

Potential Applications:
- Semiconductor industry
- Electronics manufacturing

Problems Solved:
- Efficient packaging of multiple semiconductor dies
- Improved electrical connections

Benefits:
- Enhanced performance
- Compact design

Commercial Applications:
- Semiconductor packaging companies
- Electronics manufacturers

Questions about Semiconductor Package Structure:
1. How does the recess in the first substrate benefit the overall structure?
   The recess allows for the placement of the first semiconductor die in a secure and protected manner.
2. What advantages does bonding the second semiconductor die to the second side of the first substrate offer?
   Bonding the second semiconductor die to the second side allows for efficient use of space and improved connectivity.


==Original Abstract Submitted==

The present disclosure provides a semiconductor package structure and a method of manufacturing a semiconductor package structure. The semiconductor package structure includes a first substrate having a first side and a second side opposite to the first side, wherein the first side includes a recess recessed from the first side, a first semiconductor die arranged in the recess bonded to the first side of the first substrate; a second semiconductor die bonded to the second side of the first substrate; and a second substrate electrically bonded to the first side of the first substrate.



[[Category:H01L23/538]]
[[Category:H01L23/00]]
[[Category:H01L23/13]]
[[Category:H01L23/31]]
[[Category:H01L25/065]]
[[Category:CPC_H01L23/5389]]