View source for 18097540. POLISHING APPARATUS FOR A SUBSTRATE AND POLISHING METHOD FOR A SUBSTRATE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=POLISHING APPARATUS FOR A SUBSTRATE AND POLISHING METHOD FOR A SUBSTRATE USING THE SAME=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:Donghoon Kwon of Suwon-si (KR)|Donghoon Kwon of Suwon-si (KR)]][[Category:Donghoon Kwon of Suwon-si (KR)]]

[[:Category:Boun Yoon of Suwon-si (KR)|Boun Yoon of Suwon-si (KR)]][[Category:Boun Yoon of Suwon-si (KR)]]

==POLISHING APPARATUS FOR A SUBSTRATE AND POLISHING METHOD FOR A SUBSTRATE USING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18097540 titled 'POLISHING APPARATUS FOR A SUBSTRATE AND POLISHING METHOD FOR A SUBSTRATE USING THE SAME

==Simplified Explanation==

The abstract describes a polishing apparatus for a substrate that includes a polishing pad, a platen, a light source unit, a slurry supply unit, and a polishing head. 

* The polishing pad is made of a light-transmitting material and is placed on the upper surface of the platen.
* The platen has a groove portion that overlaps with the polishing pad and rotates in one direction.
* The light source unit is housed in the groove portion of the platen and emits light of a specific wavelength to the polishing pad.
* The slurry supply unit provides a slurry containing photocatalyst particles that are excited by the light to the polishing pad.
* The polishing head is installed on the polishing pad and rotates a semiconductor substrate in close contact with the polishing pad.

Potential applications of this technology:

* Semiconductor manufacturing: This apparatus can be used for polishing semiconductor substrates, ensuring a high-quality surface finish.
* Optics manufacturing: The light-transmitting polishing pad and the light source unit can be utilized for polishing optical components, such as lenses or mirrors.
* Metal polishing: The slurry supply unit with photocatalyst particles can be employed for polishing metal surfaces, improving their smoothness and appearance.

Problems solved by this technology:

* Improved polishing efficiency: The combination of the light source unit and the slurry supply unit enhances the polishing process, resulting in faster and more effective substrate polishing.
* Enhanced surface quality: The use of a light-transmitting polishing pad and the specific wavelength light source ensures a high-quality surface finish with minimal defects.
* Uniform polishing: The rotating platen and polishing head ensure even and consistent polishing across the entire substrate.

Benefits of this technology:

* Time and cost savings: The improved polishing efficiency reduces the time required for substrate polishing, leading to cost savings in manufacturing processes.
* High-quality results: The combination of the light source unit, slurry supply unit, and polishing head ensures a superior surface finish with minimal defects.
* Versatility: The apparatus can be used for various substrates, including semiconductors, optics, and metals, making it a versatile tool in different industries.


==Original Abstract Submitted==

A polishing apparatus for a substrate, includes: a polishing pad having at least one region formed of a light-transmitting material; a platen on which the polishing pad is disposed on an upper surface thereof, having a groove portion in a region overlapping the polishing pad, and rotatably installed in one direction; a light source unit accommodated in the groove portion of the platen, and emitting light of a predetermined wavelength band to the one region of the polishing pad; a slurry supply unit supplying a slurry containing photocatalyst particles excited by the light of the predetermined wavelength band to the polishing pad; and a polishing head installed on the polishing pad to be spaced apart from the slurry supply unit in the one direction, and rotating a semiconductor substrate in close contact with the polishing pad.



[[Category:B24B53/017]]
[[Category:B24B37/24]]